Title:
STRUCTURAL BODY AND WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2012/042717
Kind Code:
A1
Abstract:
Disclosed is a structural body provided with: a first conductor (101) having a first opening (105); a second conductor (102) having a second opening (106) and opposite of at least one portion the first conductor (101); a conductor via (121) passing through the first opening (105) and the second opening (106) and insulated from the first conductor (101) and the second conductor (102); a first wire (111) disposed in the first opening (105) and opposite of the second conductor (102), and having one end connected to the conductor via (121) and the other end open; and a second wire (112) disposed in the second opening (106) and opposite of the first conductor (101), and having one end connected to the conductor via (121) and the other end open.
Inventors:
TOYAO HIROSHI (JP)
TAURA TORU (JP)
TAURA TORU (JP)
Application Number:
PCT/JP2011/004096
Publication Date:
April 05, 2012
Filing Date:
July 20, 2011
Export Citation:
Assignee:
NEC CORP (JP)
TOYAO HIROSHI (JP)
TAURA TORU (JP)
TOYAO HIROSHI (JP)
TAURA TORU (JP)
International Classes:
H01P1/203; H05K3/46
Foreign References:
| JPH07193401A | 1995-07-28 | |||
| US20050195051A1 | 2005-09-08 | |||
| JP2010010183A | 2010-01-14 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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