STRUCTURAL BODY AND WIRING SUBSTRATE

Title:

STRUCTURAL BODY AND WIRING SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2012/042740

Kind Code:

A1

Abstract:

The disclosed structural body is provided with: a first conductor (102) and a second conductor (103) opposite of one another in at least one portion; a third conductor (101) disposed between the first conductor (102) and the second conductor (103), opposite of the first conductor (102) and the second conductor (103) at at least one portion and having a first opening (105); a wire (111) provided in the first opening (105); and a conductor via (121) electrically connected to the first conductor (102) and the second conductor (103) and electrically insulated from the third conductor (101). The wire (111) is opposite of the first conductor (102) and the second conductor (103), and one end of the wire (111) is electrically connected to the third conductor (101) at the edge of the first opening (105), while the other end is open.

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Inventors:

TOYAO HIROSHI (JP)

Application Number:

PCT/JP2011/004766

Publication Date:

April 05, 2012

Filing Date:

August 26, 2011

Export Citation:

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Assignee:

NEC CORP (JP)
TOYAO HIROSHI (JP)

International Classes:

H05K3/46; H01Q15/14; H05K1/02

Foreign References:

JP2009088468A	2009-04-23
JP2009004791A	2009-01-08
JP2006246189A	2006-09-14
JP2010010183A	2010-01-14
JP2009111132A	2009-05-21

Attorney, Agent or Firm:

HAYAMI, SHINJI (JP)
Shinji Hayami (JP)

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