Title:
STRUCTURAL MATERIAL
Document Type and Number:
WIPO Patent Application WO/1992/016572
Kind Code:
A1
Abstract:
A structural material formable at low temperature, prepared by mixing a porous material with a methylol compound which acts as a binder and excipient, a resorcinol compound and/or a precondensate comprising the resorcinol compound and formaldehyde. The methylol group of the methylol compound reacts with the resorcinol compound and/or the precondensate at low temperature in a short period of time to cause curing. Accordingly, a structural material of this invention can be formed at low temperature.
Inventors:
HORIKI SEINOSUKE (JP)
ITO KUNINORI (JP)
ITO KUNINORI (JP)
Application Number:
PCT/JP1992/000348
Publication Date:
October 01, 1992
Filing Date:
March 21, 1992
Export Citation:
Assignee:
NAGOYA OILCHEMICAL (JP)
International Classes:
C08G8/00; B29C70/68; B32B27/04; B32B27/42; C08G8/10; C08G8/24; C08G14/06; C08J5/04; C08J9/00; C08L61/06; C08L61/20; (IPC1-7): B32B5/28; B32B27/04; B32B27/42; C08G8/10; C08G14/02; C08J9/42; C08L75/04
Foreign References:
| JPS54135892A | 1979-10-22 | |||
| JPS5783517A | 1982-05-25 | |||
| JPS6023410A | 1985-02-06 |
Other References:
See also references of EP 0541814A4
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