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Patent Searching and Data


Title:
STRUCTURE BODY AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/057236
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a low-cost structure body exhibiting superior shock resistance while suppressing an increase in the thickness and weight of a resin plate, and to provide a method for manufacturing the structure body. This structure body (1) is provided with: a structure (10) made of a metal or a thermosetting resin; a resin plate (14) attached onto a surface (10a) of the structure (10) with a double-sided tape (12); and a non-foaming resin sheet (A) (16) having a glass transition temperature of -20°C or less and disposed between the structure (10) and the resin plate (14). This method for manufacturing the structure body (1) includes disposing the resin sheet (A) (16) between the structure (10) and the resin plate (14) when the resin plate (14) is attached onto the surface (10a) of the structure (10) with the double-sided tape (12).

Inventors:
OKAHARA ETSUO (JP)
ASHIMA KOICHI (JP)
Application Number:
PCT/JP2016/078187
Publication Date:
April 06, 2017
Filing Date:
September 26, 2016
Export Citation:
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Assignee:
KUMI KASEI CO LTD (JP)
International Classes:
B32B15/08; B32B27/30; B32B27/32; B60R13/04
Foreign References:
JP2008537526A2008-09-18
JP2001508818A2001-07-03
JP2014170899A2014-09-18
JPH0549336U1993-06-29
JP2002345875A2002-12-03
JP2005537190A2005-12-08
JP2009539460A2009-11-19
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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