Title:
STRUCTURE FOR BONDING METAL PARTS TO EACH OTHER AND BONDING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/141829
Kind Code:
A1
Abstract:
A flange (24) is provided on the perimeter of a metal cap (21). A wire (25) is formed in a ring shape and disposed on the lower surface of the flange (24). Preferably, the wire (25) is tack-welded to the lower surface of the flange (24). The wire (25) used has a melting point in the range of -150°C to +150°C with respect to the melting points of the metal cap (21) and the metal base (22). The flange (24) of the metal cap (21) is placed on the metal base (22) with the wire (25) interposed therebetween. Then, an electric current is passed between the flange (24) of the metal cap (21) and the metal base (22) to melt the wire (25) and resistance-weld the flange (24) to the metal base (22).
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Inventors:
YOSHIOKA HIDEKAZU (JP)
NAGASAKA SHOGO (JP)
TSUCHIDA MAKOTO (JP)
YOSHIDA HITOSHI (JP)
NAGASAKA SHOGO (JP)
TSUCHIDA MAKOTO (JP)
YOSHIDA HITOSHI (JP)
Application Number:
PCT/JP2014/053824
Publication Date:
September 18, 2014
Filing Date:
February 18, 2014
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B23K11/00; B23K11/14; H01H11/00; H01H49/00; H01H50/02
Foreign References:
| JPH0663759A | 1994-03-08 | |||
| JP2002075108A | 2002-03-15 | |||
| JP2002167286A | 2002-06-11 | |||
| JPS4327944B | ||||
| JP2002075108A | 2002-03-15 |
Other References:
See also references of EP 2974821A4
Attorney, Agent or Firm:
NAKANO MASAYOSHI (JP)
Masafusa Nakano (JP)
Masafusa Nakano (JP)
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