STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY AND BONDING METHOD

WIPO Patent Application WO/2011/007646

A1

Provided is a bonding structure excellent in conductivity and bonding property between a piezoelectric body and a metal plate. In the bonding structure in which a metal plate (1) and an electrode (3) of a piezoelectric body (2) are bonded by an electrically conductive adhesive (10) so as to have electrical conductivity, the electrically conductive adhesive (10) includes carbon blacks (12a) having an average diameter of a nano-level and has a paste form included in a non-solvent system or a solvent-based resin so that the carbon blacks form an aggregate (12) with an average diameter of 1 to 50 µm. The electrically conductive adhesive (10) is coated between the metal plate and the electrode of the piezoelectric body and the metal plate (1) and the piezoelectric body (2) are heated and pressurized so that the carbon black aggregate (12) is deformed, thereby hardening the electrically conductive adhesive (10).

KITAYAMA HIROKI (JP)
NAKAGOSHI HIDEO (JP)
KURIHARA KIYOSHI (JP)

PCT/JP2010/060516

January 20, 2011

June 22, 2010

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MURATA MANUFACTURING CO (JP)
KITAYAMA HIROKI (JP)
NAKAGOSHI HIDEO (JP)
KURIHARA KIYOSHI (JP)

H01L41/09; B32B15/08; C09J5/06; C09J9/02; C09J11/04; C09J201/00; F04B45/047; H01L41/08; H01L41/083; H01L41/22; H01L41/313

WO2003078528A1	2003-09-25
WO2005026260A1	2005-03-24

JP2007329431A	2007-12-20
JP2006140142A	2006-06-01
JP2009031777A	2009-02-12
JP2002033022A	2002-01-31

TSUTSUI HIDETAKA (JP)
Hidetaka Tsutsui (JP)

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