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Patent Searching and Data


Title:
STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/007646
Kind Code:
A1
Abstract:
Provided is a bonding structure excellent in conductivity and bonding property between a piezoelectric body and a metal plate. In the bonding structure in which a metal plate (1) and an electrode (3) of a piezoelectric body (2) are bonded by an electrically conductive adhesive (10) so as to have electrical conductivity, the electrically conductive adhesive (10) includes carbon blacks (12a) having an average diameter of a nano-level and has a paste form included in a non-solvent system or a solvent-based resin so that the carbon blacks form an aggregate (12) with an average diameter of 1 to 50 µm. The electrically conductive adhesive (10) is coated between the metal plate and the electrode of the piezoelectric body and the metal plate (1) and the piezoelectric body (2) are heated and pressurized so that the carbon black aggregate (12) is deformed, thereby hardening the electrically conductive adhesive (10).

Inventors:
KITAYAMA Hiroki (Ltd. 10-1Higashikotari 1-chom, Nagaokakyo-shi Kyoto 55, 〒6178555, JP)
北山 裕樹 (〒55 京都府長岡京市東神足1丁目10番1号株式会社村田製作所内 Kyoto, 〒6178555, JP)
NAKAGOSHI Hideo (Ltd. 10-1Higashikotari 1-chom, Nagaokakyo-shi Kyoto 55, 〒6178555, JP)
Application Number:
JP2010/060516
Publication Date:
January 20, 2011
Filing Date:
June 22, 2010
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD. (10-1, Higashikotari 1-chomeNagaokakyo-shi Kyoto, 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足1丁目10番1号 Kyoto, 〒6178555, JP)
KITAYAMA Hiroki (Ltd. 10-1Higashikotari 1-chom, Nagaokakyo-shi Kyoto 55, 〒6178555, JP)
北山 裕樹 (〒55 京都府長岡京市東神足1丁目10番1号株式会社村田製作所内 Kyoto, 〒6178555, JP)
International Classes:
H01L41/09; B32B15/08; C09J5/06; C09J9/02; C09J201/00; F04B45/047
Attorney, Agent or Firm:
TSUTSUI Hidetaka (3-1-1-208 Sakuragaoka, Seika-cho,Soraku-gu, Kyoto 32, 〒6190232, JP)
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