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Patent Searching and Data


Title:
BONDED/JOINED STRUCTURE AND COMPONENT FOR AUTOMOBILES
Document Type and Number:
WIPO Patent Application WO/2020/067430
Kind Code:
A1
Abstract:
This bonded/joined structure is provided with: a first member which has a metal part and a film part that is arranged on at least a part of the surface of the metal part; a second member; and an adhesive layer which joins the first member and the second member to each other, with the film part being interposed therebetween. The film part contains an organic resin phase that contains one or more groups selected from among a urethane group, an epoxy group and an ester group, and an organic compound phase that is formed of an organosilicon compound, while optionally containing an inorganic compound phase that is formed of an inorganic silicon compound; the volume ratio of the sum of the organic compound phase and the inorganic compound phase relative to the total volume of the film part is from 16 vol% to 84 vol%; the volume ratio of the organic compound phase relative to the total volume of the film part is from 16 vol% to 84 vol%; the volume ratio of the inorganic compound phase relative to the total volume of the film part is limited to 10 vol% or less; and the organosilicon compound contains an Si-C bond and at least one of an Si-O bond and an Si-OH bond.

Inventors:
KOORI MASUMI (JP)
UEDA KOHEI (JP)
MORISHITA ATSUSHI (JP)
KOGA ATSUO (JP)
Application Number:
PCT/JP2019/038179
Publication Date:
April 02, 2020
Filing Date:
September 27, 2019
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
International Classes:
B32B15/08; B32B15/09; B32B15/092; B32B15/095; B32B15/18; C23C26/00; C23C28/00
Domestic Patent References:
WO2018083784A12018-05-11
WO2006082946A12006-08-10
WO2016076344A12016-05-19
WO2017169571A12017-10-05
Foreign References:
JP2016537491A2016-12-01
JP2018028141A2018-02-22
JPH02274537A1990-11-08
JP2018185842A2018-11-22
Other References:
See also references of EP 3858605A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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