Title:
STRUCTURE FOR CONNECTING CIRCUIT BOARDS, METHOD FOR CONNECTING CIRCUIT BOARDS AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2008/012886
Kind Code:
A1
Abstract:
To provide a structure for connecting circuit boards, a method for connecting
circuit boards and an electronic apparatus in which repair work can be performed
easily and surely while suppressing adverse electrical effects. The structure
(10) for connecting circuit boards comprises a first circuit board (12) having
a first connecting section (15) where a plurality of circuit patterns (16) are
formed in parallel on a first substrate (14), a second circuit board (13) having
a second connecting section (18) where a plurality of circuit patterns (19) are
formed in parallel on a second substrate (17), and a bonding portion (20) for connecting
the first connecting section (15) and the second connecting section (18). The
bonding portion (20) has a first adhesive layer (22) of a first anisotropic adhesive
(21) and a second adhesive layer (24) of a second anisotropic adhesive (23), and
modulus of elasticity of the second anisotropic adhesive (23) is set higher than
that of the first anisotropic adhesive (21).
Inventors:
KAWABATA, Masahito (())
川端 理仁 (())
川端 理仁 (())
Application Number:
JP2006/314810
Publication Date:
January 31, 2008
Filing Date:
July 26, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 5718501, JP)
松下電器産業株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 5718501, JP)
KAWABATA, Masahito (())
松下電器産業株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 5718501, JP)
KAWABATA, Masahito (())
International Classes:
H05K3/36
Attorney, Agent or Firm:
ICHIKAWA, Toshimitsu et al. (Eikoh Patent Office, 7-13 Nishi-Shimbashi 1-chome,Minato-k, Tokyo 03, 1050003, JP)
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