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Patent Searching and Data


Title:
STRUCTURE FOR CONNECTING WIRING CONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2013/054400
Kind Code:
A1
Abstract:
The present invention is configured of: a housing (2) for an electronic apparatus; a board-like wiring conductor (3) formed in the housing (2) by means of insert molding using resin portions (2a, 2b); a wiring terminal surface (3a) formed by bending an leading end portion of the wiring conductor (3); a hook-like protrusion (3b) formed on the wiring terminal surface (3a); a wiring terminal surface (4a) of an external wiring terminal (4) fixed by having an end portion of the wiring terminal surface in contact with the hook-like protrusion (3b); a crimping unit (4f) which connects flexible wiring (5) to the external wiring terminal (4); and a bolt (6) and a nut (7), which fasten the wiring terminal surface (3a) and the wiring terminal surface (4a) to each other. At the time of electrically connecting the wiring terminals to each other, aligning operations are facilitated, and an operation time is shortened.

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Inventors:
AKIYAMA SHUZO (JP)
HOSAKA YASUHIRO (JP)
FUJIMOTO TADAYUKI (JP)
TANIGAWA MASAAKI (JP)
Application Number:
PCT/JP2011/073380
Publication Date:
April 18, 2013
Filing Date:
October 12, 2011
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
AKIYAMA SHUZO (JP)
HOSAKA YASUHIRO (JP)
FUJIMOTO TADAYUKI (JP)
TANIGAWA MASAAKI (JP)
International Classes:
H01R9/22
Foreign References:
JP2010027410A2010-02-04
JP2009043730A2009-02-26
Other References:
See also references of EP 2768081A4
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
Masuo Oiwa (JP)
Download PDF:
Claims: