Title:
STRUCTURE, ELECTRONIC EQUIPMENT, DECORATION FILM, AND METHOD FOR MANUFACTURING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/179463
Kind Code:
A1
Abstract:
A structure according to an embodiment of the present technology is provided with a decoration film and a housing part. The decoration film includes a metal layer having first regions in which additive concentration of a prescribed element is relatively high, second regions in which the additive concentration is relatively lower than that of the first regions, and minute cracks formed on the basis of the first regions. The housing part has a region to be decorated to which the decoration film is to be bonded.
Inventors:
SHIMODA KAZUHITO (JP)
ABE ATSUHIRO (JP)
ABE ATSUHIRO (JP)
Application Number:
PCT/JP2017/014167
Publication Date:
October 19, 2017
Filing Date:
April 05, 2017
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
B32B15/08; B29C45/14
Domestic Patent References:
| WO2016125212A1 | 2016-08-11 | |||
| WO2016152252A1 | 2016-09-29 |
Foreign References:
| JP2010005999A | 2010-01-14 | |||
| JPH03268243A | 1991-11-28 | |||
| JP2009299160A | 2009-12-24 | |||
| JP2011027434A | 2011-02-10 | |||
| JP2007162125A | 2007-06-28 | |||
| JP2011163903A | 2011-08-25 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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