Title:
STRUCTURE FOR FIXING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2013/161142
Kind Code:
A1
Abstract:
This structure for fixing a first substrate (11) and a second substrate (13) to each other fixes the first substrate (11) and the second substrate (13) to each other in a state wherein the substrates overlap each other with a gap therebetween, said first substrate and second substrate being connected to each other by means of substrate-to-substrate connectors (51, 53). The structure is provided with: a spacer member (15), which is disposed between the first substrate (11) and the second substrate (13), and which maintains the gap between the first substrate (11) and the second substrate (13) at a predetermined distance; a pressing section (33), which presses the second substrate (13) in the direction toward the first substrate (11); and a lock member (17), which is fixed to the first substrate (11).
Inventors:
CHITAKA HIROKI (JP)
YOKOTA MASARU (JP)
YOKOTA MASARU (JP)
Application Number:
PCT/JP2013/000789
Publication Date:
October 31, 2013
Filing Date:
February 14, 2013
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H05K1/14; H05K7/14
Foreign References:
| JPH1168353A | 1999-03-09 | |||
| JP2006339206A | 2006-12-14 | |||
| JPH08316664A | 1996-11-29 | |||
| JPH04103676U | 1992-09-07 | |||
| JPH0653674A | 1994-02-25 | |||
| JPH0579988U | 1993-10-29 | |||
| JP2004103687A | 2004-04-02 | |||
| JP2007335820A | 2007-12-27 |
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
Gold Junki (JP)
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