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Title:
STRUCTURE-FRP MATERIAL BOND CONSTRUCTION AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/199032
Kind Code:
A1
Abstract:
Provided are: a structure-FRP material bond construction, which is a structure for bonding FRP material to structures and is characterized by a bonding layer formed from a resin and a fiber substrate being interposed between the structure and the FRP material and the bonding layer protruding from the edge of the FRP material; and a bonding method. Repair or reinforcement of an existing structure can be made easily and reliably at a construction site with the required FRP material, and in particular, a sufficiently strong bonding force between the structure and the FRP material for repair or reinforcement can be manifested and an intended repair or reinforcement performance of the FRP material for the structure can be exhibited more reliably.

Inventors:
MATSUI Takahiro (Toray Industries Inc., 1-1, Nihonbashi-Muromachi 2-chome, Chuo-k, Tokyo 66, 〒1038666, JP)
OCHI Yutaka (Toray Industries Inc., 9-1, Oe-cho, Minato-ku, Nagoya-sh, Aichi 02, 〒4558502, JP)
NAKAMURA Hitoshi (Tokyo Metropolitan University 1-1, Minami-Osawa, Hachioji-sh, Tokyo 97, 〒1920397, JP)
MATSUMOTO Yukihiro (1-1 Hibarigaoka, Tempaku-cho, Toyohashi-sh, Aichi 80, 〒4418580, JP)
Application Number:
JP2018/016473
Publication Date:
November 01, 2018
Filing Date:
April 23, 2018
Export Citation:
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Assignee:
TORAY INDUSTRIES, INC. (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 66, 〒1038666, JP)
TOKYO METROPOLITAN UNIVERSITY (3-1 Nishishinjuku 2-chome, Shinjuku-ku Tokyo, 26, 〒1630926, JP)
NATIONAL UNIVERSITY CORPORATION TOYOHASHI UNIVERSITY OF TECHNOLOGY (1-1 Hibarigaoka, Tempaku-cho Toyohashi-sh, Aichi 80, 〒4418580, JP)
International Classes:
E04G23/02; B29C65/48; B29C70/12; B29C70/18; B29C70/44; C09J7/21; C09J201/00
Foreign References:
JP2007332674A2007-12-27
JPH10513515A1998-12-22
JP2000213176A2000-08-02
US5972141A1999-10-26
Attorney, Agent or Firm:
BAN Toshimitsu et al. (Honest International Patents, Shinko Bldg. 1-9, Nishishinjuku 8-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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