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Patent Searching and Data


Title:
A STRUCTURE FOR A HEAT TRANSFER INTERFACE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2015/044773
Kind Code:
A3
Abstract:
A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof. A thickness of a raised feature at the end portion thereof is smaller than a thickness of the raised feature at an intermediate portion of the raised feature.

Inventors:
KEMPERS ROGER SCOTT (CA)
Application Number:
PCT/IB2014/002115
Publication Date:
August 06, 2015
Filing Date:
September 25, 2014
Export Citation:
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Assignee:
ALCATEL LUCENT (FR)
International Classes:
B21D22/04; H01L23/373; B21D28/24; H01L23/42; H01L23/433; F28F13/00
Domestic Patent References:
WO2002100145A12002-12-12
Foreign References:
EP1901350A12008-03-19
US20120080799A12012-04-05
US6374490B12002-04-23
US20080290504A12008-11-27
Other References:
See also references of EP 3050096A2
Attorney, Agent or Firm:
SHAMSAEI FAR, Hassan (148/152 Route de la Reine, Boulogne-billancourt, FR)
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