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Patent Searching and Data


Title:
STRUCTURE FOR IMPROVING PERFORMANCE OF TEM ALL-DIELECTRIC FILTER
Document Type and Number:
WIPO Patent Application WO/2019/119656
Kind Code:
A1
Abstract:
Disclosed in the present invention is a structure for improving performance of a transverse electromagnetic mode (TEM) all-dielectric filter. The structure comprises a dielectric cavity block, a signal shielding metal sheet, and a PCB substrate. The dielectric cavity block is soldered to the PCB substrate. One end of the signal shielding metal sheet is soldered to the dielectric cavity block, and the other end thereof is soldered to the PCB substrate. A resonance hole is disposed on the dielectric cavity block. An inner wall of the resonance hole is coated with a silver layer, and the depth of the silver layer is less than 2/3 of the depth of the resonance hole. The present invention has a simple structure and is convenient to manufacture. A silver layer having a certain depth is coated inside of a resonance hole of the existing TEM all-dielectric filter, and the height of a silver coating is controlled according to the cavity forming material and size of the hole and the aperture of the resonance hole, thereby effectively increasing a Q value of a filter while meeting the frequency requirement of a TEM all-dielectric filter. By controlling the proportion of the height of a silver coating and the height of a resonance hole, the TEM all-dielectric filter of the present invention can increase the Q value by at least 20% compared to that obtained using a traditional TEM filter.

Inventors:
MENG QINGNAN (CN)
ZHU HUI (CN)
Application Number:
PCT/CN2018/079545
Publication Date:
June 27, 2019
Filing Date:
March 20, 2018
Export Citation:
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Assignee:
HONGKONG FINGU DEVELOPMENT COMPANY LTD (CN)
International Classes:
H01P1/208; H01P1/205
Foreign References:
CN206541910U2017-10-03
CN1375888A2002-10-23
US5537082A1996-07-16
Attorney, Agent or Firm:
WUHAN KAIYUAN INTELLECTUAL PROPERTY AGENT LTD. (CN)
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