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Title:
STRUCTURE, STRUCTURE MANUFACTURING METHOD, AND MILLIMETER WAVE RADAR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/265000
Kind Code:
A1
Abstract:
Provided are: a structure obtained by joining two resin members, wherein at least one among the resin members is a resin member having a high electromagnetic wave absorption rate; a structure manufacturing method; and a millimeter wave radar module. This structure has a first member formed of a thermoplastic resin composition A and a second member formed of a thermoplastic resin composition B, wherein: the first member and the second member are at least partially joined; the transmittance of a test piece, obtained by molding the thermoplastic resin composition A so as to have a thickness of 2 mm, at a frequency of 76.5 GHz is at least 70.0%; the transmittance of a test piece, obtained by molding the thermoplastic resin composition B so as to have a thickness of 2 mm, at a frequency of 76.5 GHz is less than 50.0%; and the absorption rate of the test piece, obtained by molding the thermoplastic resin composition B so as to have a thickness of 2 mm, at a frequency of 76.5 GHz is at least 40.0%.

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Inventors:
ISEKI SHUTA (JP)
SHOJI HIDEKAZU (JP)
Application Number:
PCT/JP2022/023746
Publication Date:
December 22, 2022
Filing Date:
June 14, 2022
Export Citation:
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Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
B29C65/08; B29C65/16; B29C65/48; B29C65/56; B29C65/70; B29C65/82; B32B7/025; H01Q1/42; H01Q17/00; H05K9/00
Domestic Patent References:
WO2019088073A12019-05-09
WO2020013127A12020-01-16
Foreign References:
JP2005193614A2005-07-21
JP2005178282A2005-07-07
JP2008075077A2008-04-03
JP3231596U2021-04-15
JP2020038879A2020-03-12
JP4157300B22008-10-01
JP4040460B22008-01-30
JP2010174223A2010-08-12
JP2011132550A2011-07-07
JP6183822B12017-08-23
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF:
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