Title:
STRUCTURE AND MECHANISM FOR ELECTRICALLY-CONNECTING AN EXTERNAL-CONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2020/240997
Kind Code:
A1
Abstract:
The present disclosure relates to a structure (200) for electrically-connecting an external conductor (202). The structure comprises a wiring-substrate (204) comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers (206) and insulating layer (208). A rivet (210) is supported from the wiring substrate (204) and comprises an embedded portion within the wiring substrate (204). The embedded portion comprises: an upper section (210-1) extending through the stack of the plurality of layers, and, a bottom section (210-2) extending laterally with reference to the upper section. A portion protruding from wiring substrate (204) is provided for receiving an external-conductor (202) and for thereby electrically connecting with the wiring substrate (204).
Inventors:
RICHTER MAX
BARTZ OLAF
BARTZ OLAF
Application Number:
JP2020/011630
Publication Date:
December 03, 2020
Filing Date:
March 17, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K1/02; B21J15/02; B21K1/62; B23K20/12; H05K3/32; B29C65/64; H01R12/51; H05K3/00
Foreign References:
| US20180326924A1 | 2018-11-15 | |||
| US20070130741A1 | 2007-06-14 | |||
| US20110221268A1 | 2011-09-15 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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