Title:
STRUCTURE AND METHOD FOR FABRICATION OF A LEADLESS MULTI-DIE CARRIER
Document Type and Number:
WIPO Patent Application WO2003003797
Kind Code:
A3
Abstract:
One disclosed embodiment comprises a substrate (820) having a top surface for receiving two or more semiconductor dies (810, 812). The disclosed embodiment further comprises a printed circuit board (898) attached to a bottom surface of the substrate and at least one via in the substrate. The at least one via (827) provides an electrical connection between a signal bond pad (826) of the semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a first substrate bond pad and the printed circuit board. The first substrate bond pad is connected to the first signal bond pad of the first semiconductor die by a first signal bond wire (814). The at least one via also provides an electrical connection between the first signal bond pad of the first semiconductor die and a first land that is electrically connected to the printed circuit board (898).
Inventors:
HASHEMI HASSAN S
COTE KEVIN J
COTE KEVIN J
Application Number:
PCT/US2002/020515
Publication Date:
June 19, 2003
Filing Date:
June 27, 2002
Export Citation:
Assignee:
CONEXANT SYSTEMS INC (US)
International Classes:
H01L23/36; H01L23/12; H01L23/367; H01L23/498; H01L23/64; H01L25/04; H01L25/065; H01L25/18; (IPC1-7): H01L23/48
Foreign References:
| US6097089A | 2000-08-01 | |||
| US5640048A | 1997-06-17 | |||
| US6191477B1 | 2001-02-20 |
Other References:
See also references of EP 1407641A4
Download PDF: