Title:
STRUCTURE FOR MOUNTING THERMOCOUPLE
Document Type and Number:
WIPO Patent Application WO/2013/005272
Kind Code:
A1
Abstract:
The present invention proposes a technology of mounting a thermocouple, wherein a thermocouple is prevented from breaking when mounting, by direct welding, the thermocouple to a measurement site of a glass melting apparatus made of Pt. The present invention is characterized, in a structure for mounting a thermocouple wherein the thermocouple is to be connected and mounted onto a measurement site of a glass melting apparatus made of Pt, in that a reinforcement member for anchoring wire threads of the connected thermocouple is provided above or in the vicinity of the measurement site. This reinforcement member is preferably a Pt plate.
Inventors:
HAMADA TOKIO (JP)
Application Number:
PCT/JP2011/065154
Publication Date:
January 10, 2013
Filing Date:
July 01, 2011
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
HAMADA TOKIO (JP)
HAMADA TOKIO (JP)
International Classes:
G01K1/14; G01K7/02; H01L35/02
Foreign References:
| JPS62150642U | 1987-09-24 | |||
| JPS6263979U | 1987-04-21 | |||
| JPH0332073A | 1991-02-12 | |||
| JPH05175555A | 1993-07-13 | |||
| JPH0669771U | 1994-09-30 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
Download PDF:
Claims: