STRUCTURE FOR PROTECTING HIGH THERMAL DEVICE AND METHOD FOR RECOVERING METALLIC ELEMENT

WIPO Patent Application WO/2015/005208

A1

The objective of the present invention is to provide: a structure that is for protecting a high thermal device and that can easily recover a metal such as a platinum-group metal, causes the high thermal device to have a long use life, and can suppress oxidative vaporization and oxidative degradation even when used in an atmosphere in which oxygen is present and in a high-temperature region; and a method for recovering metallic elements. The structure for protecting a high thermal device is used in a high-temperature region of at least 1200°C, a portion or the entirety of the outer surface of the high thermal device (1) is covered by a ribbon-shaped molded body (2) containing a metal oxide as the primary component, the molded body (2) is affixed in the state of not being adhered to the outer surface of the high thermal device (1), and the molded body (2) suppresses contact between outside air and the outer surface of the high thermal device (1).

MARUKO TOMOHIRO (JP)
MIYAZAWA TOMOAKI (JP)
SAITO SHOJI (JP)
ISHIMARU TAKESHI (JP)

PCT/JP2014/067767

January 15, 2015

July 03, 2014

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FURUYA METAL CO LTD (JP)

C23C28/00; C03B5/43; C22B7/00; C23C4/10; C23C18/02; C23C26/00; F16L58/16; F27B14/10; F27D1/00; F27D1/16

JP2013060352A	2013-04-04
JP2008007353A	2008-01-17
JPH09156948A	1997-06-17
JPS63225791A	1988-09-20
JP2003105682A	2003-04-09
JPH01219178A	1989-09-01

IMASHITA, Katsuhiro et al. (JP)
Under now Katsuhiro (JP)

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