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Patent Searching and Data


Title:
STRUCTURE PROVIDED WITH RESIN PART CONTAINING CURED PRODUCT OF PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/208428
Kind Code:
A1
Abstract:
The present disclosure relates to a structure provided with: a support body; a resin part provided on a surface of the support body; and an exposure section by which a surface of the support body on which the resin part is not formed is exposed. In this structure, the resin part includes a cured product of a photosensitive resin composition, the distance from the surface of the support body to the surface of the resin part is at least 100 µm, and a side surface of the resin part constituting the exposure section continuously extends in a direction away from the surface of the support body.

Inventors:
NARITA Mao (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
ONO Keishi (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
Application Number:
JP2016/066508
Publication Date:
December 07, 2017
Filing Date:
June 02, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL COMPANY, LTD. (9-2 Marunouchi 1-chome, Chiyoda-ku Tokyo, 06, 〒1006606, JP)
International Classes:
H01F17/00; G03F7/027; H01F41/04
Foreign References:
JPH06202341A1994-07-22
JPH08181019A1996-07-12
JP2014074773A2014-04-24
JP2004253684A2004-09-09
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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