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Patent Searching and Data


Title:
STRUCTURE TO WHICH MEMBRANE IS THERMALLY BONDED, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/063351
Kind Code:
A1
Abstract:
The present invention relates to a structure to which a membrane is thermally bonded, and a method for manufacturing same. More specifically, the present invention relates to a structure to which a membrane is thermally bonded, and a method for manufacturing same, the structure having a porous nanomembrane that is thermally bonded to a bonding body so that adhesiveness between the membrane and the bonding body is improved, and thus other impaired states (for example, bonding separation), which can occur in the analysis of experiments and research, are prevented or accommodation bodies (for example, culture cells), which are accommodated in the bonding body, are prevented, during experiments and research, from leaking to the outside of the bonding body.

Inventors:
KIM DONG SUNG (KR)
YOUN JAE SEUNG (KR)
CHOI JEONG WON (KR)
PARK TAE EUN (KR)
RHYOU JUN YEOL (KR)
Application Number:
PCT/KR2023/012435
Publication Date:
March 28, 2024
Filing Date:
August 22, 2023
Export Citation:
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Assignee:
POSTECH RES & BUSINESS DEV FOUND (KR)
ULSAN NAT INST SCIENCE & TECH UNIST (KR)
International Classes:
C12M1/26; B01D61/02; C12M1/12
Foreign References:
JP2005510705A2005-04-21
JPH1176765A1999-03-23
KR20190121544A2019-10-28
KR20170142729A2017-12-28
KR20180091763A2018-08-16
KR20200081853A2020-07-08
Attorney, Agent or Firm:
WESOL IP LAW FIRM (KR)
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