Title:
STRUCTURE, WIRING BOARD, BASE MATERIAL FOR WIRING BOARDS, COPPER-CLAD LAMINATE, AND METHOD FOR PRODUCING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/064871
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a structure. This structure is provided with a silicone molded article, water and a protective material. At least a part of the surface of the silicone molded article contains a hydroxyl group. The water is in contact with at least a part of the surface that contains a hydroxyl group. The protective material retains the water.
Inventors:
NAKASHIMA HAJIME (JP)
KOMATSU IZURU (JP)
KOMATSU IZURU (JP)
Application Number:
PCT/JP2018/028119
Publication Date:
April 04, 2019
Filing Date:
July 26, 2018
Export Citation:
Assignee:
TOSHIBA KK (JP)
International Classes:
B32B27/00; C08J7/00; C08J7/02; H05K1/02; H05K1/03; H05K3/14
Domestic Patent References:
| WO2015053309A1 | 2015-04-16 |
Foreign References:
| JPS56831A | 1981-01-07 | |||
| JPS5142553A | 1976-04-10 | |||
| JP2011148263A | 2011-08-04 | |||
| JP2007039547A | 2007-02-15 | |||
| JP2005015599A | 2005-01-20 | |||
| JP2015122448A | 2015-07-02 | |||
| JP2015097257A | 2015-05-21 | |||
| JPS6136783A | 1986-02-21 |
Other References:
See also references of EP 3689597A4
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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