Title:
STRUCTURE AND WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/129200
Kind Code:
A1
Abstract:
The present invention comprises at least: a first conductor plane (101); a second conductor plane (102) that is disposed so as to face the first conductor plane (101); a first transmission line (104) that is formed on a layer being different from the first conductor plane (101) and the second conductor plane (102), is disposed facing the second conductor plane (102), and has one end being an open end; a conductor via (106) that connects the other end of the first transmission line (104) with the first conductor plane (101); and a slit (105) that is formed on the second conductor plane (102) and, starting from the position at which the slit (105) overlaps with the first transmission line (104) in plan view, extends to both sides of the first transmission line. This makes it possible to provide a structure that enables the configuration of a downsized EBG structure.
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Inventors:
KASAHARA YOSHIAKI (JP)
Application Number:
PCT/JP2016/000019
Publication Date:
August 18, 2016
Filing Date:
January 05, 2016
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01P1/00; H05K1/02; H05K1/16
Domestic Patent References:
| WO2013168377A1 | 2013-11-14 |
Foreign References:
| EP2221923A1 | 2010-08-25 | |||
| US20120032865A1 | 2012-02-09 | |||
| JP2013255259A | 2013-12-19 | |||
| US20140028412A1 | 2014-01-30 | |||
| US20070090398A1 | 2007-04-26 | |||
| US20070176827A1 | 2007-08-02 | |||
| US20130107491A1 | 2013-05-02 | |||
| US20090315648A1 | 2009-12-24 |
Attorney, Agent or Firm:
IEIRI, Takeshi (JP)
House ON 健 (JP)
House ON 健 (JP)
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