Title:
STRUCTURE WITH CONDUCTIVE PATTERN AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/090893
Kind Code:
A1
Abstract:
Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer; and has a porosity of no more than 10 volume percent in a second principal surface-side region that extends from the second principal surface to a depth of 100 nm in the thickness direction of the conductive layer.
Inventors:
KOZONO TOMOKO (JP)
YUMOTO TORU (JP)
YUMOTO TORU (JP)
Application Number:
PCT/JP2020/041415
Publication Date:
May 14, 2021
Filing Date:
November 05, 2020
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
B32B15/08; C23C18/14; C23C18/18; C23C18/40; H01B5/14; H01B13/00; H05K3/18; H05K3/38
Foreign References:
| JP2019090110A | 2019-06-13 | |||
| JP2017139294A | 2017-08-10 |
Other References:
See also references of EP 4056365A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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