STRUCTURED SAW WIRE MAINTAINING CRIMP PROPERTY UNDER SLICING TENSION

Title:

STRUCTURED SAW WIRE MAINTAINING CRIMP PROPERTY UNDER SLICING TENSION

Document Type and Number:

WIPO Patent Application WO/2015/119344

Kind Code:

A1

Abstract:

The present invention provides a structured saw wire maintaining a crimp property under slicing tension. The structured saw wire maintaining a crimp property under slicing tension comprises a unit crimp that is continuously formed in a zigzag shape, wherein the unit crimp comprises a first portion and a second portion which is bent and extended from the first portion such that an imaginary circle adjoining edges formed by the first portion and the second portion has a radius or a radius of curvature that is from 5 to 20 times a cross-sectional diameter d of the structured saw wire.

More Like This:

WO/1998/007902

METHOD TO PRODUCE A DIAMOND WIRE FOR USE IN CUTTING STONE MATERIALS, AND DIAMOND WIRE PRODUCED WITH SAID METHOD

Inventors:

LIM SEUNG HO (KR)

Application Number:

PCT/KR2014/007143

Publication Date:

August 13, 2015

Filing Date:

August 01, 2014

Export Citation:

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Assignee:

HONGDUK IND CO LTD (KR)

International Classes:

B23D61/18; B24B27/06; B24D11/00; B28D1/08

Domestic Patent References:

WO2012069314A1	2012-05-31
WO1990012670A1	1990-11-01

Foreign References:

JP2004276207A	2004-10-07
JP2012139743A	2012-07-26
JP2001205551A	2001-07-31
JP2000288901A	2000-10-17

Other References: