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Patent Searching and Data


Title:
STYRENE-BASED RESIN COMPOSITION, MOLDED ARTICLE, AND LIGHT-GUIDE PLATE
Document Type and Number:
WIPO Patent Application WO/2019/138997
Kind Code:
A1
Abstract:
Provided are: a styrene-based resin composition having excellent hue, transparency, and heat resistance; a molded article thereof; and a light-guide plate. The styrene-based resin composition contains: a styrene-based resin (A) having 20%–80% by mass of a styrene-based monomer unit and 80%–20% by mass of a (meth) acrylic acid ester-based monomer unit; a hindered phenolic antioxidant (B); a phosphorus-based antioxidant (C1) having a phenolic hydroxyl group; and a phosphorus-based antioxidant (C2) other than C1. When t1 is the oxidation induction time measured in an oxygen atmosphere of 200°C and t2 is the oxidation induction time measured in an oxygen atmosphere of 200°C after wet heat treatment for 500 hours in an air atmosphere of 80°C and 90% humidity, ideally t1 is at least 50 minutes and t1–t2 is less than 20 minutes.

Inventors:
NISHINO KOHHEI (JP)
SHIMOKOBA YUICHI (JP)
Application Number:
PCT/JP2019/000203
Publication Date:
July 18, 2019
Filing Date:
January 08, 2019
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L25/14; C08K5/13; C08K5/49; F21S2/00; F21V8/00
Domestic Patent References:
WO2013094642A12013-06-27
WO2016129675A12016-08-18
Foreign References:
JP2015067650A2015-04-13
JP2003075648A2003-03-12
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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