Title:
STYRENE DERIVATIVE, STYRENE POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING PATTERN
Document Type and Number:
WIPO Patent Application WO/2005/082956
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition used for interlayer insulating films or surface protection films which has excellent resolution and can be developed with an aqueous alkaline solution. The photosensitive resin composition is prepared using a polymer at least having a constitutional repeating unit represented by the following general formula (II). (In the formula, R1 represents a hydrogen atom or a methyl group; R2-R9 independently represent a hydrogen atom, a halogen atom or an alkyl group having 1-4 carbon atoms; X represents -CH=N-, -CONH-, -(CH2)n-CH=N-, or -(CH2)n-CONH- and the N atom in X is bonded to a carbon atom in the benzene ring having an AO- group at the o-position; A represents a hydrogen atom or an acid decomposable group; and n represents a positive integer of 1-3.)
Inventors:
MAEDA KATSUMI (JP)
NAKANO KAICHIRO (JP)
NAKANO KAICHIRO (JP)
Application Number:
PCT/JP2005/003153
Publication Date:
September 09, 2005
Filing Date:
February 25, 2005
Export Citation:
Assignee:
NEC CORP (JP)
MAEDA KATSUMI (JP)
NAKANO KAICHIRO (JP)
MAEDA KATSUMI (JP)
NAKANO KAICHIRO (JP)
International Classes:
C07C233/75; C07C251/24; C08F12/32; G03F7/022; G03F7/023; G03F7/033; G03F7/038; G03F7/039; H01L21/027; (IPC1-7): C08F12/32; C07C233/75; C07C251/24; G03F7/022; G03F7/033; H01L21/027
Foreign References:
| JP2004006273A | 2004-01-08 | |||
| JPS615249A | 1986-01-11 | |||
| JPS59174604A | 1984-10-03 | |||
| JPS62276548A | 1987-12-01 |
Attorney, Agent or Firm:
Miyazaki, Teruo (16th Kowa Bldg. 9-20, Akasaka 1-chom, Minato-ku Tokyo 52, JP)
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