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Title:
STYRENE RESIN, STYRENE RESIN COMPOSITION, MOLDED ARTICLE THEREOF, AND STYRENE RESIN PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/107526
Kind Code:
A1
Abstract:
Provided is a styrene resin having a syndiotactic structure, said styrene resin characterized in that the proportion of the amount of absorbed heat obtained in the range of 175-260°C is less than 30% when the total amount of absorbed heat measured by differential scanning calorimetry and rising at a rising temperature rate of 20°C/min is 100%. Also provided is a styrene resin composition comprising 50-95 mass% of a thermoplastic resin composition and 5-50 mass% of a glass filler, wherein the thermoplastic resin composition includes, with respect to 100 parts by mass of a thermoplastic resin (SCA) comprising 80-100 mass% of a styrene resin having a syndiotactic structure and 0-20 mass% of a rubber-like elastic body, 0.2-2.0 parts by mass of at least one antioxidant (SCB) selected from the group consisting of phenolic antioxidants and sulfuric antioxidants, 1.5-5.0 parts by mass of at least one compound (SCC) selected from the group consisting of polyphenylene ethers and modified polyphenylene ethers, and at least one selected from the group consisting of nucleating agents and mold release agents.

Inventors:
AOYAMA, Takuma (1-1 Anesakikaigan, Ichihara-shi Chiba, 93, 〒2990193, JP)
YOKOTA, Kiyohiko (1-1 Anesakikaigan, Ichihara-shi Chiba, 93, 〒2990193, JP)
Application Number:
JP2018/044101
Publication Date:
June 06, 2019
Filing Date:
November 29, 2018
Export Citation:
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Assignee:
IDEMITSU KOSAN CO.,LTD. (1-1 Marunouchi 3-chome, Chiyoda-ku Tokyo, 21, 〒1008321, JP)
International Classes:
C08F12/08; C08F4/6592; C08K3/40; C08K5/13; C08K5/36; C08L25/06; C08L71/12
Foreign References:
JPH0543622A1993-02-23
JPH07247390A1995-09-26
JP2013189560A2013-09-26
JP2013203877A2013-10-07
JP2009256420A2009-11-05
JP2010031283A2010-02-12
JPH07316216A1995-12-05
JPH08120110A1996-05-14
JP2001354727A2001-12-25
JP2013010851A2013-01-17
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (OHTANI PATENT OFFICE, Toranomon ES Bldg. 7F. 25-2, Toranomon 3-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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