Title:
HEATER/SENSOR SUB-ASSEMBLY AND SOLDER CARTRIDGE
Document Type and Number:
WIPO Patent Application WO/2015/182487
Kind Code:
A1
Abstract:
The present invention pertains to a structure for a heater/sensor sub-assembly for a soldering cartridge and solder suction cartridge of a soldering system. This structure provides high heat capacity and accurate soldering-iron-tip-temperature detection and control functions. A coil part of a heater assembly is set apart from a distal end part of the sub-assembly toward the base end side in order to place a distance between a thermocouple temperature sensor and a coil. The solder cartridge includes connector wires linking a coil wire of a heater to a connecting part between a handle and a soldering station, the connector wires varying in size and material in order to reduce the conduction of heat to the handle.
Inventors:
MOCHIZUKI TOSHIKAZU (JP)
MATSUZAKI KENJI (JP)
TAKEUCHI HITOSHI (JP)
MATSUZAKI KENJI (JP)
TAKEUCHI HITOSHI (JP)
Application Number:
PCT/JP2015/064660
Publication Date:
December 03, 2015
Filing Date:
May 21, 2015
Export Citation:
Assignee:
HAKKO CORP (JP)
International Classes:
B23K3/02; B23K3/03; G01K7/02; H05B3/00
Foreign References:
| JP2004314111A | 2004-11-11 | |||
| JPH038566A | 1991-01-16 | |||
| JPH02104178U | 1990-08-20 | |||
| US1820799A | 1931-08-25 | |||
| JP2006150365A | 2006-06-15 | |||
| US6054678A | 2000-04-25 |
Other References:
See also references of EP 2987579A4
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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