[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Serial No. 63/049,852 filed on July 9, 2020, the content of which is relied upon and incorporated herein by reference in its entirety.

FIELD

[0002] The present disclosure relates generally to substrate apparatus and methods and, more particularly, to substrate support apparatus, substrate packaging apparatus and methods.

BACKGROUND

[0003] It is known to store substrates as a leaning stack of substrates. Typically, a leaning stack of substrates are produced by successively placing individual substrates against one another until the stack is complete. In some embodiments, the leaning stack of substrates may be packaged for shipment, storage and/or handling. During the process of stacking, undesirable fanning may occur wherein one or more of the substrates in the leaning stack of substrates is not parallel with one or more other substrates in the stack of substrates such that a thickness at one location of the leaning stack of substrates is different than a thickness at another location of the leaning stack of substrates. There is a desire to control fanning of the leaning stack of substrates to maintain the proper positioning of all of the substrates in the leaning stack and/or to protect one or more substrates in the leaning stack of substrates from being damaged due to excessive stress concentrations that may be inherent due to excessive fanning.

SUMMARY

[0004] The following presents a simplified summary of the disclosure to provide a basic understanding of some embodiments described in the detailed description.

[0005] In some embodiments, the substrate support apparatus used to stack the substrate on a leaning stack of substrates can also be used to determine a characteristic (e.g., a fanning) of the leaning stack of substrates. This dual functionality can allow the characteristic to be determined with the substrate support apparatus as each substrate is stacked on the leaning stack of substrates with the substrate support apparatus. Thus, determining the characteristic can be performed in a reduced amount of time and can be performed after each additional substrate is stacked.

[0006] In some embodiments, a compacting device can be used to reduce fanning while stacking the substrates to form the leaning stack of substrates. In some embodiments, a single compacting cycle may be provided that can be beneficial to reduce the fanning while minimizing the time needed to conduct the compacting procedure. In further embodiments, the compacting procedure can comprise two compacting cycles after each substrate is stacked. Two compacting cycles can provide even further reduced fanning when compared to a single compacting cycle. The reduced fanning can also be achieved with reduced compacting pressure during each of the two compacting cycles, thereby reducing potential stress fractures compared to a single compacting cycle using a larger compacting pressure.

[0007] In some embodiments, a substrate support apparatus can comprise a base and a plurality of suction devices. Each suction device of the plurality of suction devices can be movably mounted to the base. The substrate support apparatus can further comprise a monitoring device configured to monitor a position of a suction device of the plurality of suction devices.

[0008] In some embodiments, the monitoring device is configured to monitor the position of the suction device relative to the base.

[0009] In some embodiments, the monitoring device can comprise an ultrasonic sensor.

[0010] In some embodiments, the ultrasonic sensor can be fixedly mounted to the base.

[0011] In some embodiments, each suction device of the plurality of suction devices can be movably mounted to the base to translate along an adjustment direction relative to the base.

[0012] In some embodiments, the plurality of suction devices can comprise a column of suction devices. Each suction device of the column of suction devices can be spaced from another suction device of the column of suction devices along a column axis that is perpendicular to the adjustment direction.

[0013] In some embodiments, at least one suction device of the plurality of suction devices can be independently movable relative to at least one additional suction device of the plurality of suction devices.

[0014] In some embodiments, a substrate packaging apparatus for packaging a leaning stack of substrates can comprise a substrate support structure configured to support the leaning stack of substrates. The substrate support structure can comprise a rear surface configured to support a major surface of a substrate of the leaning stack of substrates. The substrate support structure can further comprise a lower surface extending away from the rear surface and configured to support a lower edge of the substrate of the leaning stack of substrates. The substrate packaging apparatus can further comprise a compacting device comprising a compacting axis extending along a width of the rear surface.

[0015] In some embodiments, the substrate packaging apparatus can comprise a plurality of actuators configured to apply a force to a lower portion of the leaning stack of substrates along the compacting axis.

[0016] In some embodiments, the compacting device can comprise a plurality of actuators configured to apply a varying force to a lower portion of the leaning stack of substrates along the compacting axis.

[0017] In some embodiments, at least one actuator of the plurality of actuators can operate independently of at least one another actuator of the plurality of actuators.

[0018] In some embodiments, the compacting device can comprise a plurality of apertures in communication with a fluid pressure chamber.

[0019] In some embodiments, a method can comprise stacking a plurality of substrates on a substrate support structure to form a leaning stack of substrates. The method can further comprise imaging a feature of the leaning stack of substrates and determining a characteristic of the leaning stack of substrates using information obtained during the imaging.

[0020] In some embodiments, the characteristic of the leaning stack of substrates can comprise a fanning of the leaning stack of substrates. [0021] In some embodiments, the method can further comprise stacking an additional substrate on the leaning stack of substrates with a substrate support apparatus supporting the additional substrate, and compacting the leaning stack of substrates by engaging the additional substrate with a compacting device.

[0022] In some embodiments, the compacting device can apply pressure along a compacting axis when compacting the leaning stack of substrates.

[0023] In some embodiments, the compacting axis can be positioned along a lower portion of the leaning stack of substrates when compacting the leaning stack of substrates.

[0024] In some embodiments, the compacting device can apply varying pressure to the additional substrate along the compacting axis when compacting the leaning stack of substrates.

[0025] In some embodiments, the compacting device can generate a fluid cushion between the additional substrate and the compacting device when compacting the leaning stack of substrates.

[0026] In some embodiments, the compacting can be conducted while the substrate support apparatus supports the additional substrate.

[0027] In some embodiments, the method can further comprise disengaging the substrate support apparatus from the additional substrate.

[0028] In some embodiments, the disengaging the substrate support apparatus from the additional substrate can occur while compacting the leaning stack of substrates with the compacting device.

[0029] In some embodiments, the method can further comprise disengaging the compacting device from the additional substrate.

[0030] In some embodiments, the method can further comprise reengaging the additional substrate with the compacting device.

[0031] In some embodiments, a method can comprise stacking an additional substrate on a leaning stack of substrates with a substrate support apparatus engaging the additional substrate. The method can further comprise determining a characteristic of the leaning stack of substrates with the substrate support apparatus while the substrate support apparatus engages the additional substrate. [0032] In some embodiments, a plurality of suction devices of the substrate support apparatus can be removably attached to the additional substrate while stacking the additional substrate on the leaning stack of substrates.

[0033] In some embodiments, the determining the characteristic can comprise moving one suction device of the plurality of suction devices relative to another suction device of the plurality of suction devices.

[0034] In some embodiments, the determining the characteristic can comprise monitoring a position of the one suction device.

[0035] In some embodiments, the position of the one suction device can be monitored with an ultrasonic sensor.

[0036] In some embodiments, the method can further comprise compacting the leaning stack of substrates with a compacting device pressing against the additional substrate.

[0037] In some embodiments, the compacting the leaning stack of substrates can comprise applying pressure to the additional substrate along a compacting axis with the compacting device.

[0038] In some embodiments, the compacting axis can be positioned along a lower portion of the leaning stack of substrates when compacting the leaning stack of substrates.

[0039] In some embodiments, the compacting device can apply varying pressure to the additional substrate along the compacting axis when compacting the leaning stack of substrates.

[0040] In some embodiments, compacting device can generate a fluid cushion between the leaning stack of substrates and the compacting device when compacting the leaning stack of substrates.

[0041] In some embodiments, the compacting can be conducted while the substrate support apparatus engages the additional substrate.

[0042] In some embodiments, the method can further comprise ceasing to apply pressure to the additional substrate with the compacting device over a period of time, and then reapplying pressure to the additional substrate along the compacting axis with the compacting device. [0043] In some embodiments, the method can comprise disengaging the substrate support apparatus from the additional substrate prior to the reapplying pressure. The reapplying pressure can be conducted while the substrate support apparatus is disengaged from the additional substrate.

[0044] Additional features and advantages of the embodiments disclosed herein will be set forth in the detailed description that follows, and in part will be clear to those skilled in the art from that description or recognized by practicing the embodiments described herein, including the detailed description which follows, the claims, as well as the appended drawings. It is to be understood that both the foregoing general description and the following detailed description present embodiments intended to provide an overview or framework for understanding the nature and character of the embodiments disclosed herein. The accompanying drawings are included to provide further understanding, and are incorporated into and constitute a part of this specification. The drawings illustrate various embodiments of the disclosure, and together with the description explain the principles and operations thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

[0045] These and other features, aspects and advantages are better understood when the following detailed description is read with reference to the accompanying drawings, in which:

[0046] FIG. 1 is a schematic view of a substrate support apparatus placing a supported substrate on a leaning stack of substrates in accordance with aspects of the disclosure;

[0047] FIG. 2 illustrates a plan view of a substrate to be placed on a leaning stack of substrates of FIG. 1;

[0048] FIG. 3 schematically illustrates an imaging apparatus being used to determine a characteristic of a leaning stack of substrates;

[0049] FIG. 4 is a schematic view of another substrate support apparatus placing a supported substrate on a leaning stack of substrates in accordance with aspects of the disclosure;

[0050] FIG. 5 schematically illustrates a base of the substrate support apparatus taken along line 5-5 of FIGS. 1 and 4; [0051] FIG. 6 schematically illustrates the substrate support apparatus of FIG. 4 being used to determine a characteristic of a leaning stack of substrates;

[0052] FIG. 7 schematically illustrates the substrate support apparatus of FIG. 4 after the supported substrate is placed on the leaning stack of substrates with a compacting device disengaged from the leaning stack of substrates;

[0053] FIG. 8 schematically illustrates the substrate support apparatus of FIG. 7 after the supported substrate is placed on the leaning stack of substrates with the compacting device pressing against the supported substrate to compact the leaning stack of substrates;

[0054] FIG. 9 schematically illustrates a sectional view of the compacting device and leaning stack of substrates taken along line 9-9 of FIG. 7;

[0055] FIG. 10 schematically illustrates a sectional view of the compacting device and leaning stack of substrates taken along line 10-10 of FIG. 8;

[0056] FIGS. 11-12 illustrate embodiments of steps of compacting the leaning stack of substrates with the compacting device of FIGS. 7-10;

[0057] FIG. 13 schematically illustrates a sectional view of another embodiment of a compacting device and leaning stack of substrates taken along line 9-9 of FIG. 7;

[0058] FIG. 14 schematically illustrates a sectional view of the compacting device and leaning stack of substrates of FIG. 13 taken along line 10-10 of FIG. 8;

[0059] FIG. 15 is partial front view of the compacting device of FIGS. 13-14 taken along line 15-15 of FIG. 13;

[0060] FIG. 16 is a schematic sectional view of the compacting device of FIGS. 13-15 taken along line 16-16 of FIG. 15;

[0061] FIG. 17 schematically illustrates the compacting device continuing to press against the previously supported substrate of the leaning stack of substrates while the substrate support apparatus is disengaged from the previously supported substrate;

[0062] FIG. 18 schematically illustrates the compacted leaning stack of substrates of FIG. 17 after the compacting device is disengaged from the leaning stack of substrates; and [0063] FIGS. 19-20 are plots comparing experimental results of fanning with respect to the number of substrates as the substrates are stacked in the leaning stack of substrates.

DETAILED DESCRIPTION

[0064] Embodiments will now be described more fully hereinafter with reference to the accompanying drawings in which example embodiments are shown. Whenever possible, the same reference numerals are used throughout the drawings to refer to the same or like parts. However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0065] In some embodiments, methods of processing substrates in a substrate packaging process can be provided to help monitor the condition of the stack and enhance the quality of the stack of substrates. Substrates of the disclosure can comprise glass substrates, although glass-ceramic, ceramic, silicon substrates, or other substrate material. In some embodiments, the substrate can comprise a glass substrate with a variety of compositions including, but not limited to, soda-lime glass, borosilicate glass, alumino- borosilicate glass, alkali -containing glass, or alkali-free glass. In some embodiments, glass substrates may be produced by separating the glass substrate from a glass ribbon produced by a glass manufacturing apparatus such as a slot draw apparatus, float bath apparatus, down-draw apparatus, up-draw apparatus, press-rolling apparatus or other glass ribbon manufacturing apparatus. Substrates comprising glass substrates can be suitable for further processing into a desired application, e.g., a display application. For example, the glass substrates can be used in a wide range of display applications, including liquid crystal displays (LCDs), electrophoretic displays (EPD), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), or the like. Glass substrates may need to be transported from one location to another. The substrates (e.g., glass substrates) may be transported as a leaning stack of substrates discussed throughout the application. Moreover, interleaf material can optionally be placed between each substrate (e.g., glass substrate) to help prevent contact and therefore preserve the pristine surfaces of the substrate.

[0066] As shown in FIGS. 1-2, the substrate 101 (e.g., glass substrate) can comprise a length “L” and a width “W” perpendicular to the length. As shown in FIG. 2, the substrate 101 can comprise an outer perimeter comprising a rectangular shape where the length “L” can be defined between two parallel end edges 201a, 201b and the width “W” can be defined between two parallel side edges 203a, 203b. As shown, each end edge 201a, 201b can extend in a direction that is perpendicular to the direction in which each side edge 203a, 203b extends. In some embodiments, the width “W” of the substrate 101 can be greater than or equal to about 20 mm, such as greater than or equal to about 50 mm, such as greater than or equal to about 100 mm, such as greater than or equal to about 500 mm, such as greater than or equal to about 1000 mm, such as greater than or equal to about 2000 mm, such as greater than or equal to about 3000 mm, such as greater than or equal to about 4000 mm, although other widths less than or greater than the widths mentioned above can be provided in further embodiments. For example, in some embodiments, the width “W” of the substrate 101 can be from about 20 mm to about 4000 mm, such as from about 50 mm to about 4000 mm, such as from about 100 mm to about 4000 mm, such as from about 500 mm to about 4000 mm, such as from about 1000 mm to about 4000 mm, such as from about 2000 mm to about 4000 mm, such as from about 3000 mm to about 4000 mm, such as from about 20 mm to about 3000 mm, such as from about 50 mm to about 3000 mm, such as from about 100 mm to about 3000 mm, such as from about 500 mm to about 3000 mm, such as from about 1000 mm to about 3000 mm, such as from about 2000 mm to about 3000 mm, such as from about 2000 mm to about 2500 mm, and all ranges and subranges therebetween.

[0067] The substrate 101 (e.g., glass substrate) can comprise a first major surface 103a and a second major surface 103b facing opposite directions and defining a thickness “T” (e.g., average thickness) of the substrate 101. In some embodiments, the thickness “T’ of the substrate 101 can be less than or equal to about 2 millimeters (mm), less than or equal to about 1 millimeter, less than or equal to about 0.5 millimeters, for example, less than or equal to about 300 micrometers (pm), less than or equal to about 200 micrometers, or less than or equal to about 100 micrometers, although other thicknesses may be provided in further embodiments. For example, in some embodiments, the thickness “T’ of the substrate 101 can be from about 50 pm to about 750 pm, from about 100 pm to about 700 pm, from about 200 pm to about 600 pm, from about 300 pm to about 500 pm, from about 50 pm to about 500 pm, from about 50 pm to about 700 pm, from about 50 pm to about 600 pm, from about 50 pm to about 500 pm, from about 50 pm to about 400 pm, from about 50 pm to about 300 pm, from about 50 pm to about 200 mih, from about 50 mhi to about 100 mih, including all ranges and subranges of thicknesses therebetween.

[0068] FIGS. 1, 3-4, 6-8, and 17-18 illustrate embodiments a substrate support rack 107 of embodiments of substrate packaging apparatus 105, 401 in accordance with aspects of the disclosure. The substrate support rack 107 can be configured to support a leaning stack 109 of substrates 101. The substrate support rack 107 can comprise a rear surface 111 configured to support a major surface 103b of a substrate 101 of the leaning stack 109 of substrates 101. For example, as shown, in some embodiments, a rear plate 113 can comprise the rear surface 111. The rear plate 113 can comprise a continuous plate or a lattice of support members defining the rear surface 111. The substrate support rack 107 can further comprise a lower surface 115 extending away from the rear surface 111 and configured to support a lower edge of the substrate 101 of the leaning stack 109 of substrates 101. For example, as shown, in some embodiments, a lower plate 117 can comprise the lower surface 115. The lower plate 117 can comprise a continuous plate or a lattice of support members defining the lower surface 115. As shown, the lower surface 115 can extend away from the rear surface 111 at substantially 90° although the lower surface 115 can extend away from the rear surface 111 at other angles in further embodiments. The rear plate 113 and/or lower plate 117 can comprise stainless steel, plastic, wood, or other material that can support the leaning stack 109 of substrates 101. As further shown in FIG. 1, the rear surface 111 can extend at an angle “A” relative to a direction “G” of gravity. The angle “A” can range from greater than 0° to about 60°, such as from greater than 0° to about 45°, such as greater than 0° to about 30°, such as greater than 0° to 20°, such as from greater than 0° to 20°, and all ranges and subranges therebetween. In further embodiments, the angle “A” can range from about 10° to about 60°, such as from about 10° to about 45°, such as from about 10° to about 30°, such as from about 10° to 20°, and all ranges and subranges therebetween. In further embodiments, the angle “A” can range from about 20° to about 60°, such as from about 20° to about 45°, such as from about 20° to about 30°, and all ranges and subranges therebetween. For purposes of this application, a stack of substrates is considered a “leaning stack of substrates” if a substrate in the stack of substrates has a major surface that is oriented at any one of the above angles “A” relative to “G” gravity. Thus by stacking substrates against the rear surface 111 that extends at an angle “A” relative to the direction “G” of gravity within the ranges discussed above, the stack of substrates can comprise a leaning stack of substrates supported by the substrate support rack 107. For example, a major surface of a rear substrate in the leaning stack of substrates can be supported against the rear surface 111 and, like the rear surface 111, can be supported at an orientation where the major surface of the of the rear substrate extends at an angle “A” relative to the direction “G” of gravity within the ranges discussed above. Consequently, the stack of substrates would be considered a leaning stack of substrates since at least the major surface of the rear substrate extends at an angle “A” relative to the direction “G” of gravity within the ranges discussed above.

[0069] As shown, a stand 119 may be designed to support the rear surface 111 at the desired angle “A”. For example, the stand 119 can support the position of the rear plate 113 and the lower plate 117 relative to one another and support the weight of the rear plate 113, the lower plate 117, and the leaning stack 109 of substrates 101. In some embodiments, the stand 119 can comprise a support surface 120 that may rest on a horizontal surface such that the support surface 120 is perpendicular to the direction “G” of gravity. In some embodiments, an angle “B” between the support surface 120 and the rear surface 111 can equal to the angle “A” subtracted from 90°.

[0070] The substrate packaging apparatus 105 shown in FIG. 1 can comprise a substrate support apparatus 121 configured to help build the leaning stack 109 of substrates 101 on the substrate support rack 107. In some embodiments, as shown, the substrate support apparatus 121 can comprise a plurality of suction devices 123 mounted to a base 125. FIG. 5 illustrates one embodiment of the base 125 that is viewed along line 5-5 of FIG. 1. As shown, the base 125 can include to parallel side rails 503a, 503b that can support the suction devices 123 along respective columns of suction devices. The parallel side rails 503a, 503b can be mounted to a center rail 505 that can be manipulated by the robot 129 (see FIG. 1). In some embodiments, the suction devices 123 can each comprise a suction cup 127. The suction cups 127 can be placed in communication with a fluid source to control the suction associated with each suction cup 127 to cause selective attachment and release to the first major surface 103a of the substrate 101. In some embodiments, a vacuum (e.g., from a negative pressure source) can be associated with one or more of the suction cups. The vacuum can be used to increase the attachment force between the suction cup and the first major surface 103a. In further embodiments, the vacuum source can be adjustable to increase or decrease the attachment force. In some embodiments, the fluid source may comprise a positive pressure source to eject the substrate from the suction cup once the substrate is properly placed on the leaning stack of substrates. In some embodiments, the fluid source (e.g., positive pressure source and/or negative pressure source) may provide the same positive pressure/vacuum force for all the suction cups of each column or may provide the same positive pressure/vacuum force for all of the suction cups of all columns. In further embodiments, one or more suction cups may have a suction force that can be operated independently of the other suction cups.

[0071] In operation, the robot 129 may move the base 125 and corresponding suction devices 123 to pick a substrate 101 to be stacked. The substrate to be picked can be traveling along a conveyor, can be separated from a ribbon after the ribbon is produced, or other locations. In order to pick the substrate 101, the robot 129 can manipulate the base 125 until the suction cups 127 of the suction devices 123 engage the first major surface 103a of the substrate 101. It will be appreciated that the suction cups 127 can be engaged adjacent the outer side edges 203a, 203b (see FIG. 2) of the substrate to help maintain the pristine nature of the central portion of the major surface 103a of the substrate 101. As shown in FIG. 1, the robot can move the substrate 101 into position such that it is added to the leaning stack 109 of substrates 101 in the leaning orientation.

[0072] After a significant number of substrates 101 have been stacked, fanning may unfortunately occur where one location of the leaning stack 109 has a maximum thickness “Tl” in a direction perpendicular to the rear surface 111 that is greater than a minimum thickness “T2” of another location of the leaning stack 109 in the direction perpendicular to the rear surface 111. As shown, the location with the greatest thickness “Tl” can be located at an intermediate location of the leaning stack 109 although the greatest thickness “Tl” may be positioned near or at the upper end of the leaning stack 109 or near or at the lower end of the leaning stack 109. Throughout the application, fanning is considered a difference between the maximum thickness “Tl” and the minimum thickness “T2”.

[0073] In some embodiments, an overall fanning may exist across the entire surface area of leaning stack 109 of substrates wherein the entire leaning stack 109 of substrates includes a single maximum thickness “Tl” and a single minimum thickness “T2” wherein the overall fanning of the leaning stack 109 of substrates is considered the difference between the single maximum thickness “Tl” and the single minimum thickness “T2” In further embodiments, a lengthwise fanning may vary at different positions along the width “W” of the substrate 101. For instance, a lengthwise fanning may exist at a location along the width along a linear lengthwise axis extending through the location in a direction of the length “L” of the outer substrate 101 of the leaning stack 109 of substrates 101. In such examples, the lengthwise fanning at a location along the width “W” is considered the difference between the maximum thickness “Tl” along the linear lengthwise axis passing through the location and the minimum thickness “T2” along the linear lengthwise axis passing through the location.

[0074] FIGS. 4 and 6-8 illustrate additional embodiments of a substrate support apparatus 403 of the substrate packaging apparatus 401. The substrate support apparatus 403 can comprise the base 125 (e.g., as illustrated and described with reference to FIG. 5), and a plurality of suction devices 405. Each suction device 405 of the plurality of suction devices 405 can be movably mounted to the base 125. In some embodiments each suction device 405 of the plurality of suction devices can be movably mounted to the base 125 to translate along an adjustment direction relative to the base 125. For example, as shown in FIG. 4, each suction device 405 of the plurality of suction devices 405 can translate along a first adjustment direction 407a to extend relative to the base 125 and/or a second adjustment direction 407b to retract relative to the base 125. As shown, in some embodiments, each suction device 405 can comprise a guide rod 409 slidably mounted to the base 125 with the suction cup 127 positioned at one end of the guide rod 409. In some embodiments, although not shown, each suction device 405 may comprise a biasing device (e.g., compression spring) may bias each suction device 405 in the first adjustment direction 407a to the extended position shown in FIG. 4. [0075] As shown in FIG. 4, the substrate support apparatus 403 can also comprise a base. For example, the base 125 discussed with respect to FIG. 5 above can also comprise a base of the substrate support apparatus 403 taken along line 5-5 of FIG. 4. The base 125 can include to the parallel side rails 503a, 503b that can support the suction devices 405 along respective columns of suction devices. While two columns of suction devices are illustrated, in further embodiments, three or more columns of suction devices may be provided. For example, the base 125 can include three or more parallel side rails that can support the suction devices. In some embodiments, a plurality of the suction devices 405 (see FIG. 4) can comprise the first column of suction devices 405 positioned along a first column axis 501a of the first column. In some embodiments, the plurality of suction devices 405 can further comprise the second column of suction devices 405 positioned along a second column axis 501b of the second column. Although not shown, in some embodiments, the plurality of suction devices can comprise three or more columns of suction devices positioned along a corresponding column axis. As shown in FIG. 5, each suction device 405 of the plurality of suction devices 405 can be spaced apart from another suction device 405. For example, each suction device 405 can be positioned between a pair of suction devices 405 that are each adjacent the suction device 405. The column axis 501a, 501b can be perpendicular to the adjustment direction 407a, 407b of the suction devices 405. In some embodiments, the parallel side rails 503a, 503b can be mounted to the center rail 505 that can be manipulated by the robot 129. While two parallel side rails 503a, 503b are illustrated, in further embodiments, three or more parallel side rails may be provided (e.g., mounted to the center rail 505) that can be manipulated by the robot 129. A corresponding column axis may be provided with each of the parallel side rails where suction devices of may be spaced apart along a corresponding column axis. In some embodiments, the suction devices 405 can each comprise the suction cup 127. The suction cups 127 can be placed in communication with a fluid source to cause selective attachment and release to the first major surface 103a of the substrate 101.

[0076] In some embodiments, at least one suction device of the plurality of suction devices 405 can be independently movable relative to at least one additional suction device of the plurality of suction devices 405. For example, at least one suction device 405 shown in FIG. 4 can be moved along the adjustment directions 407a, 407b while one or more of the remaining suction devices of the plurality of suction devices remain stationary relative to the base 125. In some embodiments, each suction device can be independently movable relative to the remaining suction devices (e.g., along the adjustment directions 407a, 407b).

[0077] As shown in FIGS. 4 and 6-8, the substrate support apparatus 403 can also comprise a monitoring device 411 configured to monitor a position of a suction device 405 of the plurality of suction devices 405. In some embodiments, the monitoring device 411 can be configured to monitor the position of the suction device 405 relative to the base 125. For example, the monitoring device may be designed to monitor the position of the guide rod 409 relative to the base 125. In some embodiments, the monitoring device may be designed to monitor the suction cup 127 of the suction device 405, either directly or by monitoring the position of the guide rod 409 relative to the base 125. In some embodiments, the monitoring device may comprise a proximity sensor able to monitor a position of the suction device 405 relative to the base 125 without physical contact although physical contact sensors may also be incorporated in accordance with aspects of the disclosure. Embodiments of a proximity sensor can include optical sensors (e.g., laser sensors), ultrasonic sensors or other types of proximity sensors. As shown schematically in FIG. 4, in some embodiments, the monitoring device 411 may comprise an ultrasonic sensor 413 configured to monitor a position of the suction device 405 relative to the base 125 without requiring physical contact between the suction device 405 and the base 125 to monitor the position. In some embodiments, the proximity sensor (e.g., ultrasonic sensor 413) may be fixedly mounted to the base 125 to monitor a position of a portion of the suction device 405 relative to the base. In some embodiments, an end of the guide rod 409 may be provided with a flag 415 extending across the sensing path of the proximity sensor. For example, as shown, ultrasonic waves 417a may travel to intersect with the flag 415 positioned across the sensing path of the ultrasonic sensor 413. The reflected ultrasonic waves 417b reflecting off the flag 415 can then travel back to be sensed by the ultrasonic sensor 413. Signals can then be sent back to a processor 137 to calculate the position of the flag 415 of the suction device 405 relative to the base 125. Although not shown, the ultrasonic sensor may be mounted to the guide rod (e.g. at the end of the guide rod) wherein the ultrasonic waves are reflected off the base 125. However, fixedly mounting the ultrasonic sensor to the base 125 can simplify the construction of the device as the communication path from the ultrasonic sensor 413 to the processor 137 can be supported by the base 125.

[0078] As shown, the monitoring device may monitor a position of one or any plurality of suction devices of the plurality of suction devices. For example, as shown in FIG. 4, the monitoring device 411 can monitor the position of each suction device 405 of the plurality of suction devices 405 relative to the base 125. For instance, as shown, each suction device 405 of the plurality of suction devices 405 may be provide with a proximity sensor (e.g., ultrasonic sensor). Providing each suction device 405 with a sensor (e.g., proximity sensor) can allow tracking of each suction device independently in embodiments where one or all of the suction device 405 can independently move relative to one another.

[0079] In some embodiments, the substrate packaging apparatus 105, 401 may be provided with a compacting device. For purposes of discussion, embodiments of the substrate packaging apparatus 401 of FIGS. 4, and 6-18 will be discussed as optionally comprising a compacting device 701 (FIG. 9-12), 1301 (FIG. 13-16). Although not shown, the substrate packaging apparatus 105 of FIGS. 1 and 3 can also comprise a compacting device 701, 1301 with similar or identical features and functionality discussed more fully below. As shown in FIGS. 9 and 13, the compacting device 701, 1301 can comprise a compacting axis 901 extending along the width “WR” of the rear surface 111. In some embodiments, the outer surface of the press member can comprise the compacting axis. As shown in FIGS. 9 and 13, the width “WR” of the rear surface 111 can be substantially the same as the width “W” of the substrate 101 (see FIG. 2) although the width “WR” of the rear surface 111 can be greater than or less than the width “W” of the substrate 101 in further embodiments. Providing a width “WR” of the rear surface 111 that is greater than or equal to the width “W” of the substrate 101 can help fully support the entire width of the substrate 101, thereby reducing stress concentrations and possible damage to the substrate 101. In some embodiments, the compacting axis 901 can comprise a substantially straight compacting axis 901. For example, in some embodiments, the rear surface 111 can comprise a substantially flat surface wherein a substantially straight compacting axis 901 can help evenly distribute compacting force across the width of the substrate 101 during a compacting procedure. In further embodiments, the rear surface 111 can comprise a convex or concave surface wherein the flat surface (represented by the straight line at 111 in FIGS 9 and 13) would be curved and represented by an arcuate line. Providing the rear surface as a convex or concave surface may help flex the stack of substrates into a curved shape corresponding to the convex or concave rear surface. Flexing the substrates into a curved orientation can strengthen the substrates and/or help prevent shifting of the substrates relative to the rear surface 111. In embodiments where the rear surface 111 is a concave or convex surface, the compacting axis 901 may comprise curved axis with a shape matching the curved shape of the convex or concave rear surface along the width “WR” of the rear surface.

[0080] In some embodiments, the compacting device can comprise at least one actuator. For example, as shown in FIG. 7, a base member 703 of the compacting device can comprise at least one actuator configured to extend and retract a press member 705, 1305 defining the compacting axis 901 of the compacting device 701, 1301. As shown, in some embodiments, the compacting device 701, 1301 may comprise an abutment device 904, 1304 that includes the press member 705, 1305. In some embodiments, the actuator of the base member 703 can provide an extension in direction 707a and a retraction in direction 707b of the abutment device 904, 1304. In some embodiments, the directions 707a, 707b can be substantially perpendicular to the rear surface 111. In further embodiments, in addition or alternative to the actuator of the base member, the abutment device 904, 1304 can comprise one or more actuators 903 (see FIG. 9) configured to provide extension/retraction in directions 707a, 707b of the press member 705, 1305 relative to a support member 907. In some embodiments, as shown, the one or more actuators 903 can selectively extend rods 902, and the press member 705, 1305 associated with the rods 902 in direction 707a. As shown, in some embodiments, the compacting device 701, 1301 can comprise a plurality of actuators configured to apply a force to the lower portion of the leaning stack 109 of substrates 101 along the compacting axis 901. [0081] As shown in FIGS. 9 and 13, in some embodiments, the one or more actuators 903 can of the compacting device 701, 1301 can comprise a plurality of actuators 903. As shown, in some embodiments, the plurality of actuators 903 can comprise a row of actuators 903 that are sequentially spaced apart with each actuator 903 of the plurality of actuators positioned next to one adjacent actuator or between two adjacent actuators. In some embodiments, each actuator of the plurality of actuators 903 configured to apply a varying force to the lower portion of the leaning stack 109 of substrates 101 along the compacting axis 901 although each actuator may apply the same force in further embodiments. In addition or alternatively, in some embodiments, at least one or all of the actuators of the plurality of actuators can operate dependently or independently of at least one another actuator (e.g., all of the other actuators). For example, if the press member comprises a single rigid press member, all of the actuators of the plurality of actuators 903 may operate at the same time and provide the same force such that the length of the press member moves in the extension/retraction directions 707a, 707b. In further embodiments, as shown in FIGS. 11-12, the press member 705 can comprise a flexible press member where part of the press member may be moved in the extension/retraction directions 707a, 707b relative to another part of the press member. In still further embodiments, the press member may comprise a segmented press member where a plurality of segments of the press member are configured to move relative to one another. For example, as shown in FIG. 13, the press member 1305 can comprise segments 1307a, 1307b, 1307c that can be moved relative to one another in the extension/retraction directions 707a, 707b.

[0082] In some embodiments, as shown in FIG. 10, the press member 705 can be designed to physically contact the lower portion of the outer substrate of the leaning stack 109 of substrates 101 when applying force to the lower portion of the leaning stack 109 of substrates 101. In alternative embodiments, as shown in FIG. 14, the press member 1305 may be designed to apply force to the lower portion of the leaning stack 109 of substrates 101 in a contactless manner where the press member 1305 produces a fluid cushion 1401 that applies force to the lower portion of the outer substrate of the leaning stack 109 of substrates without the press member 1305 physically contacting the outer substrate of the leaning stack 109 of substrates 101. Applying force in a contactless manner can help prevent damage to the substrates that might otherwise occur of the press member physically contacts the substrate(s). As shown in FIGS. 15-16, the compacting device can provide the press member 1305 with a plurality of apertures 1501 in communication with a fluid pressure chamber 1601. As shown in FIG. 15, the plurality of apertures can comprise a pattern of apertures 1501 spaced apart to provide the desired fluid cushion configuration in use. Furthermore, as shown in FIG. 16, in some embodiments, the fluid pressure chamber 1601 may comprise multiple fluid pressure chambers although a single fluid pressure chamber may be provided in further embodiments. Each pressure chamber 1601 can comprise one or more inlet ports 1602 pressurized fluid to enter the pressure chamber 1601. If multiple pressure chambers are provided, the pressurized fluid within each chamber may be adjusted relative to one another to provide a fluid cushion having varying characteristics along the overall length of the press member 1305. As shown in FIG. 16, each segment 1307a, 1307b may comprise one or more pressure chambers that can be pressurized independently to allow each segment to apply a unique fluid cushion. Providing a plurality of apertures 1501 associated with a corresponding pressure chamber can also be beneficial to help provide more control over the characteristics of the fluid cushion (e.g., pressure profile applied by the fluid cushion).

[0083] In some embodiments, methods of the disclosure can include stacking a plurality of substrates 101 on a substrate support structure (e.g., substrate support rack 107) to form the leaning stack 109 of substrates 101. In some embodiments, the robot 129 can be provided that can pick an individual substrate 101, such as a glass substrate, from a conveyor belt or other location or can support the substrate while it is separated from a ribbon during a ribbon (e.g., glass ribbon) forming process. The robot 129 can then manipulate the substrate into the appropriate orientation such that, as shown in FIG. 1, the substrate 101 supported by the substrate support apparatus 121 is substantially parallel to the rear surface 111 and/or the existing leaning stack 109 of substrates. As shown in FIG. 1, in some embodiments, the plurality of suction cups 127 may be removably attached to the substrate 101 while supporting the substrate and moving the substrate to be stacked with other substrates in the leaning stack 109 of substrates. In some embodiments, a negative pressure source can be placed in communication with the suction area of the suction cup to further enhance and maintain the attachment of the suction cup to the substrate help prevent inadvertent detachment of the suction cups from the substrate 101. Once the robot 129 has properly placed the supported substrate, the suction cups can release the substrate. For example, a positive pressure source can increase the pressure within the suction area of the suction cup to cause the suction cup to release the substrate in the proper position. The robot can then be retracted out of the vicinity of the leaning stack 109 of substrates as shown in FIG. 3.

[0084] In some embodiments, methods of the disclosure can further comprise determining a characteristic of the leaning stack of substrates without contacting any of the substrates 101. For example, as shown in FIG. 3, the robot 129 can be removed from the vicinity of the leaning stack 109 of substrates. Then, an imaging apparatus 131 can be used to image a feature of a substrate 101 (e.g., outermost substrate) and then determine a characteristic of the leaning stack 109 of substrates 101 using information obtained during the imaging. In some embodiments, the characteristic of the leaning stack 109 of substrates 101 can comprise a fanning of the leaning stack 109 of substrates 101. In some embodiments, the fanning can comprise the overall fanning of the leaning stack 109 of substrates 101. For example, the overall fanning can comprise “T2” subtracted from “Tl” wherein the greatest thickness “Tl” of the leaning stack 109 of substrates 101 may not be aligned with the smallest thickness “T2” along the same linear axis extending in a direction of the length “L”. Thus, the overall fanning can comprise one value associated with the surface area of a major surface of the outermost substrate. In further embodiments, the fanning can comprise a lengthwise fanning that can comprise “T2” subtracted from “Tl” wherein the “Tl” is aligned with “T2” along the same linear axis extending in a direction of the length “L”. In such embodiments, the leaning stack 109 of substrates 101 can comprise a lengthwise fanning at each location along the width of the leaning stack 109 of substrates 101.

[0085] In one embodiment, as shown in FIGS. 1 and 3, the fanning can be determined by the imaging apparatus 131. In some embodiments, the imaging apparatus 131 can comprise the illustrated digital image correlation device that can comprise a source of light 133 and a pair of cameras 135. One available imaging apparatus 131 can comprise an ARAMIS digital image correlation device available from Trilion Quality Systems. The digital image correlation device can be designed to determine the three- dimensional position of various markers associated with the outer surface of the leaning stack 109 of substrates 101. In some embodiments, the markers can comprise reflective tabs adhered to the major surface of the substrate 101. For example, referring to FIG. 2, a plurality of markers 205 can be aligned in two columns 207a, 207b along a linear axis 209a, 209b extending in a direction 211 of the length “L” In such an example, the imaging apparatus 131 can determine the lengthwise fanning at two locations along the width “W” of the substrate 101. In some embodiments, the markers 205 can be provided on one or more of the substrates 101. In further embodiments, a substrate including the markers 205 can be reused to conduct multiple periodic measurements. For instance, the substrate including the markers 205 can be placed with the substrate support apparatus 121 to conduct the fanning measurement. Once the imaging apparatus 131 has completed the measurement, the substrate support apparatus 121 can remove the substrate including the markers 205 and then continue stacking additional substrates if appropriate. Such measurements can be designed to measure the fanning after stacking a selected number of substrates (e.g., after stacking 10, 20, 40, 60, etc. substrates). Furthermore, although the substrate with the markers can comprise the same type of substrate as the substrates in the leaning stack 109 of leaning substrates, in further embodiments, the substrate with the markers 205 can comprise a different material that may be more durable or less expensive than the substrates stacked in the leaning stack 109 of substrates 101.

[0086] As shown in FIG. 3, once the substrate with the markers 205 is placed, light 301 emitted from an illumination device 133 of the digital image correlation device can reflect off of each of the markers 205 to be detected by a pair of cameras 135 spaced apart from one another (not shown) along the width “W”. The reflected light received by the cameras 135 is then processed by a processor 137 to determine the location of the markers 205 and output to an output device 303 such as a storage unit for digitally storing the data or a display device for visually displaying the data. As shown, the results from each periodic measurement with the digital correlation device can be displayed in a graph with the vertical axis 305 indicating the marker number and the horizontal axis 307 indicating the thickness of the leaning stack 109 of leaning substrates 101. As shown, the last measurement illustrates the maximum stack thickness “Tl” of about 46 at marker #5 and a minimum stack thickness “T2” of about 32 at marker #1 wherein the lengthwise fanning at the last measurement is about 14 (i.e., 46-32). In some embodiments, an alarm may sound if the fanning reaches a predetermined maximum allowable fanning. In further embodiments, the substrate support apparatus 121 may discontinue loading additional substrates 101 once the fanning reaches a predetermined maximum allowable fanning.

[0087] FIGS. 4 and 6 illustrate further embodiments of determining a characteristic of a leaning stack 109 of substrates 101. As shown, the substrate support apparatus 403 can be used to stack multiple substrates 101, wherein the characteristic can be determined while stacking the next substrate onto the leaning stack 109. For example, FIG. 4 shows, the stacking an additional substrate 101 being supported and engaged by the substrate support apparatus 403 on a leaning stack 109 of substrates. In some embodiments, the first and second columns of suction cups 127 (see FIG. 5) can be selectively attached to portions of a major surface of the substrate 101 (e.g., the outer edge portions of the major surface). By engaging the outer portions, the pristine nature of the central portion of the major surface may be maintained without damage due to scratches or other imperfections that may be introduced by the suction cups 127. In some embodiments, the suction cups 127 can be placed in communication with a fluid source to control the suction associated with each suction cup 127 to cause selective attachment and release to the first major surface 103a of the substrate 101. In some embodiments, a vacuum source can be associated with one or more of the suction cups. The vacuum source can be used to provide a suction that increases the attachment force between the suction cup to the first major surface 103a. In further embodiments, the vacuum source can be adjustable to increase or decrease the attachment force. In some embodiments, the fluid source may comprise a positive pressure source to eject the substrate from the suction cup once the substrate is properly placed on the leaning stack of substrates. In some embodiments, the fluid source (e.g., pressure source and/or vacuum source) may provide the same pressure/vacuum force for all the suction cups of each column or may provide the same pressure/vacuum force for all of the suction cups of all columns. In further embodiments, one or more suction cups may have a suction force that can be operated independently of the other suction cups. [0088] In operation, a robot 129 may move the base 125 and corresponding suction devices 123 to pick a substrate 101 to be stacked. The substrate to be picked can be traveling along a conveyor, can be separated from a ribbon after the ribbon is produced, or other locations. In order to pick the substrate 101, the robot 129 can manipulate the base 125 until the suction cups 127 of the suction devices 123 engage the first major surface 103a of the substrate 101. It will be appreciated that the suction cups 127 can be engaged adjacent the outer side edges 203a, 203b of the substrate to help maintain the pristine nature of the central portions of the major surface 103a of the substrate 101. As shown in FIG. 1, the robot can move the substrate 101 into position such that it is added to the leaning stack 109 of substrates 101 in the leaning orientation.

[0089] As shown in FIG. 6, the characteristic of the leaning stack 109 of substrates can be determined with the substrate support apparatus 403 while the substrate support apparatus 403 engages the additional substrate 101 and prior to disengagement of the placed additional substrate 101 from the substrate support apparatus 403. As discussed previously, the plurality of suction devices 405 of the substrate support apparatus 103 can be removably attached to the additional substrate while stacking the additional substrate on the leaning stack of substrates. As shown in FIG. 4, the substrate support apparatus 103 can be moved in direction 402 by the robot 129. In some embodiments, each suction device of the plurality of suction devices 405 may move in a first adjustment direction 407a or a second adjustment direction 407b relative to one or more other suction device(s) of the plurality of suction devices 405 and relative to the base 125. As such, the supported additional substrate 101 can conform to the shape of the outer stacked substrate of the leaning stack 109 of substrates while the suction devices 405 can independently move relative to one another and relative to the base 125. Indeed, each suction device 405 may be biased outwardly (e.g. by a compression spring) so that the suction devices compress and thereby conform the supported additional substrate 101 to match the shape of the outer most substrate of the stack of substrates. As schematically shown in FIG. 6, the increased thickness of the leaning stack 109 of substrates 101 at “Tl” can cause the corresponding suction devices 405 to move in the second adjustment direction 407b such that the corresponding suction cup 127 retracts toward the base 125. As the suction device 405 moves in the second adjustment direction 407b, the corresponding guide rod 409 causes the corresponding flag 415 to move away from the base 125 in the second adjustment direction 407b. In some embodiments, a sensor such as the illustrated ultrasonic sensor 413 can monitor the position of the suction device 405. For instance, as shown in FIG. 4, ultrasonic waves 417a may be emitted from the ultrasonic sensor 413 and bounced off the flag 415 and back toward the sensor as reflected ultrasonic waves 417b to be sensed by the ultrasonic sensor 413. Signals can then be sent back to a processor 137 to calculate the position of the flag 415 of the suction device 405 relative to the base 125. In such a way, the corresponding characteristic (e.g., fanning) can be determined by monitoring the position of each suction device 405. In some embodiments, these positions can be relayed to the output device 303 discussed above such as a storage unit for digitally storing the data or a display device for visually displaying the data. In some embodiments, an alarm may sound if the fanning reaches a predetermined maximum allowable fanning. In further embodiments, the substrate support apparatus 403 may discontinue loading additional substrates 101 once the fanning reaches a predetermined maximum allowable fanning.

[0090] In some embodiments, one may select from either the imaging apparatus 131 of FIG. 1 or the monitoring device 411 of FIG. 4 to determine a characteristic (e.g., fanning) of a leaning stack 109 of substrates. However, in some embodiments, the monitoring device 411 can monitor each substrate 101 as it is added to the leaning stack 109 of substrates and does not require placement of a substrate with markers 205 for periodic monitoring. Thus, the monitoring device 411 can provide continuous feedback, and therefore quickly discover developing issues with fanning and does not require process interruption or additional expense involved with providing a substrate with markers 205 that can only feasibly provide periodic testing.

[0091] Methods of the disclosure can also comprise a compacting device designed to reduce fanning of the leaning stack of substrates. In some embodiments, compacting devices of the disclosure may be used in combination with the imaging apparatus 131 of FIGS. 1-3. In further embodiments, compacting devices of the disclosure may be used in combination with the substrate support apparatus 403 and monitoring device 411 of FIG. 4. [0092] Embodiments of compacting devices 701, 1301 used in combination with the substrate support apparatus 403 and monitoring device 411 of FIG. 4 will now be discussed with the understanding that the compacting devices may similarly or identically used in combination with the imaging apparatus 131 of FIGS. 1-3. Referring to FIG. 7, the substrate support apparatus 403 can place an additional substrate 101 engaged and supported by the suction devices 405 on the leaning stack 109 of substrates 101. Once placed, as shown in FIGS. 7 and 9, the abutment device 904, 1304 may be extended in direction 707a by an actuator of the base member 703 in order to bring the press member 705, 1305 near the leaning stack 109 of substrates 101. As shown in FIG. 10, one or more actuators 903 can provide extension of the press member 705, 1305 in direction 707a by the rods 902 until the press member 705, 1305 presses and applies force to the substrate 101 engaged and supported by the substrate support apparatus 403. As shown in FIGS. 8 and 10, the force applied by the press member 705, 1305 acts to compact the leaning stack 109 of substrates 101.

[0093] As shown in FIG. 8, the leaning stack 109 of substrates 101 can be compacted with the press member 705, 1305 of the compacting device 701, 1301 pressing against the substrate 101 to compact the leaning stack 109 of substrates 101 while the substrate 101 is still being engaged and/or supported by the substrate support apparatus 403. Although not shown, some alternative embodiments may disengage the substrate support apparatus 403 from the supported substrate prior to initially contacting the previously supported substrate with the press member 705, 1305 of the compacting device 701, 1301. However, disengaging the substrate support apparatus 403 from the substrate while compacting the leaning stack of substrates with the compacting device can help assist removing the substrate support apparatus 403 from the leaning stack of substrates without inadvertently pulling one or more of the substrates away from the stack as the substrate support apparatus is removed. Indeed, the press member 705, 1305 can act to hold the supported substrate in place while the substrate support apparatus 403 is pulled away form the stack, thereby maintaining the compact configuration and reducing inadvertent fanning that may otherwise occur when pulling the substrate support apparatus 403 out of contact with the leaning stack 109 of substrates 101. FIG. 17 demonstrates embodiments where the substrate support apparatus 403 is pulled away while the press member 705 of the compacting device 701, 1301 continues to press against the outer substrate in the leaning stack 109 of substrates 101.

[0094] FIG. 18 illustrates disengagement of the compacting device 701, 1301 from the outer substrate of the leaning stack 109 of substrates 101. In some embodiments, the process can comprise a single compacting cycle where the compacting device 701, 1301 presses against the placed outer substrate a single time. After disengagement of the compacting device 701, 1301 (see FIG. 18), the substrate support apparatus 403 can place yet an additional substrate on the leaning stack 109 of substrates 101 and similarly proceed, as discussed above, to perform a single compacting cycle to again compact the leaning stack 109 of substrates 101 with compacting device 701, 1301. The process and then proceed until the stack is complete after a predetermined number of substrates have been stacked or after a predetermined maximum fanning level is detected.

[0095] In alternative embodiments, two or more compacting cycles may be performed on a substrate placed on the leaning stack of substrates. For example, after disengagement of the press member 705, 1305 of the compacting device 701, 1301 from the outer substrate of the leaning stack 109 of substrates 101, a second compacting cycle can be performed wherein the press member 705, 1305 reengages the same outer substrate by again extending in direction 707a as shown in FIG. 17. In some embodiments, methods can apply pressure to the outer substrate of the leaning stack 109 of substrates 101 with the press member 705, 1305 of the compacting device 701, 1301 over a period of time to compact the leaning stack 109 of substrates 101, then the compacting device 701, 1301 can cease applying pressure to the substrate over a period of time (e.g., by retracting the press member 705, 1305 as shown in FIG. 18), and then reapply the pressure to the same substrate along the compacting axis 901 with the compacting device 701, 1301 (as shown in FIG. 17). In some embodiments, the substrate support apparatus can be disengaged from the outer substrate prior to the reapplying pressure, wherein the reapplying pressure is conducted while the substrate support apparatus is disengaged from the additional substrate (e.g., see FIG. 17). In alternative embodiments, the substrate support apparatus can remain engaged with the outer substrate throughout the two or more compacting cycles (e.g., see FIG. 8). [0096] FIGS. 19-20 are plots of experimental results comparing fanning (represented by the vertical y-axis, e.g., in millimeters) with respect to the number of substrates in the leaning stack of substrates (represented by the horizontal x-axis). FIG. 19 represents two experimental runs of stacking 330 substrates in a leaning stack of substrates where packing performance was measured periodically after a number of substrates have been stacked. Plot 1901 represents an experimental run where without compacting while plot 1903 represents an experimental run with a single compacting cycle of 30 pounds per square inch (207 Kilopascal) applied to a lower portion of the leaning stack of substrates after each substrate is stacked. As shown, comparing stacking with a single compacting cycle (see plot 1903) with stacking without compacting (see plot 1901), the single compacting cycle can significantly reduce the fanning from greater than 7 millimeters (mm) to less than 4 mm.

[0097] FIG. 20 represents two experimental runs of stacking 110 substrates in a leaning stack of substrates where packing performance was measured periodically after a number of substrates have been stacked. Plot 2001 represents an experimental run with a single compacting cycle of 30 pounds per square inch (207 Kilopascal) applied to a lower portion of the leaning stack of substrates after each substrate is stacked. Plot 2003 represents an experimental run with two compacting cycles after each substrate is stacked wherein each compacting cycle of the two compacting cycles applied 10 pounds per square inch (69 Kilopascal) to a lower portion of the leaning stack with a 5 second delay between each compacting cycle of the two compacting cycles. As shown, comparing stacking with a two compacting cycles (see plot 2003) with stacking with one compacting cycle (see plot 2001), stacking with two compacting cycles can significantly reduce the fanning from about 12 mm to about 6 mm.

[0098] Thus, as shown by FIG. 19, a single compacting cycle using a pressure of 30 pounds per square inch (207 Kilopascal) applied to the lower portion of the leaning stack can provide reduced fanning compared to stacking without a single compacting cycle. Furthermore, as shown by FIG. 20, even further increased performance can be achieved with two compacting cycles with only 1/3 the pressure applied to the lower portion of the leaning stack. In some embodiments, a single cycle may be used to reduce fanning where there is a desire to quickly form the stack of substrates with improved fanning. Furthermore, while two cycles may take additional time to produce the stack of substrates, performing two cycles at lower pressure after placement of each substrate on the leaning stack of substrates can further reduce fanning while also reducing the chance of stress fractures due to the lower pressure used when compacting the leaning stack of substrates.

[0099] As discussed above, the single compacting cycle can use the press member to apply a pressure of 30 pounds per square inch (207 Kilopascal) to the leaning stack of substrates although, in some embodiments, the pressure may be anywhere ranging from about 10 pounds per square inch (psi) (69 Kilopascal) to about 80 psi (552 Kilopascal), such as from about 20 psi (138 Kilopascal) to about 40 psi (276 Kilopascal). As discussed above, the each cycle of the two compacting cycles can use the press member to apply a pressure of 10 psi (69 Kilopascal) to the leaning stack of substrates although, in some embodiments, the pressure may be anywhere ranging from about 5 psi (34 Kilopascal) to about 20 psi (138 Kilopascal), such as from about 8 psi (55 Kilopascal) to about 12 psi (83 Kilopascal).

[00100] In some embodiments, the compacting axis 901 can extend along the outer surface of the press member 705, 1305. In further embodiments, the outer surface of the press member 705, 1305 may include the compacting axis 901, wherein the compacting the leaning stack 109 of substrates 101 comprises applying pressure to the substrate supported by the substrate support apparatus 403 along the compacting axis 901 with the compacting device 701, 1301. As shown in FIGS. 7-8, the compacting axis 901 can be positioned along a lower portion of the leaning stack 109 of substrates 101 when compacting the leaning stack of substrates. In some embodiments, the lower portion of the leaning stack of substrates can comprise the lower 50%, 40%, 30%, 20% or 10% of the length “L” of the leaning stack 109 of substrates 101. Although not show, the compacting axis 901 may be located in a central portion or upper portion of the leaning stack 109 of substrates. In still further embodiments, a plurality of press members may be provided at a lower portion, central portion, and/or upper portion of the leaning stack 109 of substrates.

[00101] In some embodiments, the compacting device can apply a substantially constant pressure along the length of the compacting axis when compacting the leaning stack of substrates. For example, as shown, in FIG. 9, in some embodiments, all of the actuators 903 can substantially equally force the press member 705 extension direction 707a such that the entire outer surface of the press member 705 simultaneously engages the outer surface of the outer substrate 101 of the leaning stack 109 (e.g., along the entire width “W” of the leaning stack 109 of substrates). As shown in FIG. 10, the press member 705 may maintain a substantially constant compacting pressure along the width “W” of the leaning stack 109 of substrates to provide uniform packing along the width “W” of the leaning stack 109. In some embodiments, the press member 705 can be substantially rigid to allow consistent pressure to be applied by the press member 705 between the rods 902. In some embodiments, the press member 705 can comprise plastic, metal, or other material.

[00102] In some embodiments, the compacting device can apply varying pressure to the additional substrate along the compacting axis 901 when compacting the leaning stack of substrates. For example, in some embodiments, the press member 705 may be flexible or segmented to allow outer portions of the press member 705 to engage the outer substrate at different times. For example, as shown in FIGS. 11-12, the press member 705 may begin contacting one side of the outer substrate and then continue to successively engage the outer substrate across the width “W” until the other side is reached. In an alternate embodiment, an intermediate portion of the outer substrate may be engaged wherein the press member 705 continues to successively engage additional portions in opposite directions towards the opposed sides of the outer substrate. In such a manner, fanning may be reduced as gas (e.g., air) can be squeezed out of the stack without being trapped as gas pockets within the stack. In some embodiments, once the engagement is complete, a constant pressure can be maintained across the width “W” of the leaning stack 109 of substrates to provide consistent compacting of the leaning stack 109

[00103] In some embodiments, the method may include compacting without direct contact between the press member and the outer substrate. For example, as shown in FIG. 15, the press member 1305 may include a plurality of apertures 1501 designed to provide a fluid cushion between the press member 1305 and the outer substrate. In operation, gas (e.g., compressed air) may be introduced through thee inlet port into the fluid pressure chamber 1601. The fluid pressure chamber 1601 can supply a uniform flow of compressed gas through the apertures 1501 in fluid communication with the fluid pressure chamber. As shown, in some embodiments, the press member 1305 may comprise the plurality of segments 1307a, 1307b, 1307c. In some embodiments, the construction of each segment 1307a, 1307b, 1307c may be similar although different constructions may be provided in further embodiments. Furthermore, although a plurality of segments are shown, a single segment may be provided in further embodiments. However, multiple segments can allow independent control of the pressure within each pressure chamber 1601 of each segment that can provide different air cushion profiles due to the differing rates that the pressurized gas may flow through the apertures 1501. Multiple segments may also allow independent movement of each segment 1307a, 1307b, 1307c in direction 707a to allow successive engagement of the press member 1305 with the outer substrate (e.g., to prevent excessive fanning by avoiding trapped gas pockets). As shown in FIG. 14, the press member 1305 may generate a fluid cushion 1401 (e.g., air cushion) between the leaning stack 109 of substrates 101 and the press member 1305 of the compacting device 1301 when compacting the leaning stack 109 of substrates 101. In some embodiments, the fluid cushion 1401 can facilitate application of force to the leaning stack 109 of substrates 101 without actually mechanically contacting any of the substrates.

[00104] It should be understood that while various embodiments have been described in detail with respect to certain illustrative and specific examples thereof, the present disclosure should not be considered limited to such, as numerous modifications and combinations of the disclosed features are possible without departing from the scope of the following claims.