Title:
SUBSTRATE ASSEMBLY AND AIR CONDITIONING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/157793
Kind Code:
A1
Abstract:
The present invention provides a substrate assembly for supplying electrical power to a device constituting an air conditioning apparatus. This substrate assembly has a wiring substrate, a cuboid-shaped chip capacitor disposed on the wiring substrate, and a cuboid-shaped first member and a cuboid-shaped second member that are disposed on the wiring substrate so as to flank the chip capacitor. The chip capacitor is disposed so as to at least partially overlap with each of a first protection area, which is a chip-capacitor-side semicircular region for which the side of the first member facing the chip capacitor forms the diameter, and a second protection area, which is a chip-capacitor-side semicircular region for which the side of the second member facing the chip capacitor forms the diameter, in plan view.
Inventors:
KOBATA TOMOKI (JP)
FUJIMA YOSHIKO (JP)
IKEUCHI NAOYA (JP)
MORIMOTO YUSUKE (JP)
FUJIMA YOSHIKO (JP)
IKEUCHI NAOYA (JP)
MORIMOTO YUSUKE (JP)
Application Number:
PCT/JP2019/002690
Publication Date:
August 06, 2020
Filing Date:
January 28, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K1/02; H01G2/06; H05K1/18
Foreign References:
| JP2011035330A | 2011-02-17 | |||
| JP2008061372A | 2008-03-13 | |||
| JP2014229761A | 2014-12-08 | |||
| JP2002368349A | 2002-12-20 | |||
| JP2008047605A | 2008-02-28 |
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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