Title:
SUBSTRATE ATTACHING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/116554
Kind Code:
A1
Abstract:
This substrate attaching structure is provided with: a first substrate having a first connector that is provided on the surface thereof; a second substrate that is provided with a second connector to be attached to and detached from the first connector; and a board-like member covering a part of the first substrate. The board-like member has: an orientation-regulating section, which is formed by folding a part of the board-like member to the first substrate side, and which regulates the attitude of the second substrate with respect to the first substrate at the time of mounting the second connector on the first connector; and a position regulating section, which is formed by folding a part of the board-like member, and which regulates the position at which the second substrate is to be disposed with respect to the first substrate in a state wherein the second connector is mounted on the first connector.
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Inventors:
ARAKAWA NAOKI (JP)
Application Number:
PCT/JP2017/033698
Publication Date:
June 28, 2018
Filing Date:
September 19, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/00; G02B23/24
Domestic Patent References:
| WO2011052408A1 | 2011-05-05 |
Foreign References:
| JP2005129866A | 2005-05-19 | |||
| US20140094067A1 | 2014-04-03 | |||
| US20140187060A1 | 2014-07-03 |
Other References:
See also references of EP 3560407A4
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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