Title:
SUBSTRATE-BONDING DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2011/010729
Kind Code:
A1
Abstract:
Disclosed is a device that positions a first substrate , which has a wiring/electrode pattern formed on the surface thereof, and a second substrate, which has a wiring/electrode pattern formed on the surface thereof, such that the wiring/electrode patterns on the substrates face each other, and then bonds the substrates together. The disclosed device is provided with: a means for holding the second substrate; a means for bending the held second substrate; and a means for bringing the first substrate and the second substrate close to each other, one of said substrates being coated with a curable resin, and pressing the second substrate towards the first substrate. The disclosed device and method minimize the amount of curable resin coating while preventing the incorporation of voids and increasing the contact area between opposing wiring/electrode patterns with respect to the comparatively large total surface area of the substrates on which wiring/electrode patterns are formed.
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Inventors:
TERADA Katsumi (1-45, Oe 1-chome, Otsu-sh, Shiga 41, 〒5202141, JP)
Application Number:
JP2010/062453
Publication Date:
January 27, 2011
Filing Date:
July 23, 2010
Export Citation:
Assignee:
Toray Engineering Co., Ltd. (Nihonbashi Muromachi Bldg, 3-16 Nihonbashi Hongokucho 3-chome, Chuo-k, Tokyo 21, 〒1030021, JP)
東レエンジニアリング株式会社 (〒21 東京都中央区日本橋本石町三丁目３番１６号（日本橋室町ビル） Tokyo, 〒1030021, JP)
東レエンジニアリング株式会社 (〒21 東京都中央区日本橋本石町三丁目３番１６号（日本橋室町ビル） Tokyo, 〒1030021, JP)
International Classes:
H05K3/46; H05K3/36
Attorney, Agent or Firm:
BAN Toshimitsu (Honest International Patents, Shinko Bldg. 1-9, Nishishinjuku 8-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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