Title:
SUBSTRATE BONDING METHOD, SUBSTRATE BONDING SYSTEM, AND MICROFLUIDIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/172898
Kind Code:
A1
Abstract:
The present invention bonds two substrates firmly at low cost, without modifying surfaces. A substrate bonding system (10) includes a temporary bonding unit (11) that superimposes, on a first substrate (21) made of a first resin with a first glass transition temperature, a second substrate (22) made of a second resin with a second glass transition temperature lower than the first glass transition temperature, and pressure-bonds the substrates together at a predetermined temperature and a predetermined pressure. The predetermined temperature is a temperature between the first glass transition temperature and the second glass-transition temperature. The substrate bonding system (10) further includes a final bonding unit that heats the mutually pressure-bonded first substrate and second substrate, at a temperature substantially equal to the second glass transition temperature, for a predetermined time.
Inventors:
OGAI NORIYUKI (JP)
IWAHORI KIMIAKI (JP)
IWAHORI KIMIAKI (JP)
Application Number:
PCT/JP2022/004729
Publication Date:
August 18, 2022
Filing Date:
February 07, 2022
Export Citation:
Assignee:
ASTI CORP (JP)
International Classes:
B81B1/00; B01J19/00; B29C65/02
Foreign References:
| JP2020011403A | 2020-01-23 | |||
| JP2003211545A | 2003-07-29 | |||
| JP2013010076A | 2013-01-17 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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