SUBSTRATE BREAKING APPARATUS - MITSUBOSHI DIAMOND IND CO LTD

Title:

SUBSTRATE BREAKING APPARATUS

Document Type and Number:

WIPO Patent Application WO/2010/087424

Kind Code:

A1

Abstract:

Provided is a substrate breaking apparatus which can accurately perform breaking position alignment even in the case where a brittle material substrate to be broken is thin and is to be broken with a small pitch. The substrate breaking apparatus is provided with: a substrate supporting plate (2) having an opening section (7) formed thereon in a rectangular shape that corresponds to the shape of a brittle material substrate (1); an elastic film (4) which is formed on the upper surface of the substrate supporting plate (2) and covers the opening section (7); upper breaking bars (6a, 6b) which are arranged to move in the vertical direction above the elastic film (4) and break the substrate along a scribe line (11); and a lower breaking bar (5) which is arranged to move in the vertical direction below the elastic film (4) and breaks the substrate along the scribe line (11). The lower breaking bar (5) is brought into contact with the side opposite to the side having the scribe line (11) formed thereon with pressure along the scribe line (11), and in the state where the brittle material substrate (1) is sandwiched between the lower breaking bar (5) and the first upper breaking bar (6a), the substrate is broken by means of the upper breaking bar (6b).

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Inventors:

SOYAMA MASANOBU (JP)

Application Number:

PCT/JP2010/051185

Publication Date:

August 05, 2010

Filing Date:

January 29, 2010

Export Citation:

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Assignee:

MITSUBOSHI DIAMOND IND CO LTD (JP)
SOYAMA MASANOBU (JP)

International Classes:

B28B11/14; B26F3/00; B28D5/00; C03B33/06; H01L21/301

Foreign References:

JP2006289625A	2006-10-26
JPH04249343A	1992-09-04
JP2007073602A	2007-03-22
JP2000001326A	2000-01-07
JP2008140615A	2008-06-19
JPH11242236A	1999-09-07
JPH11138523A	1999-05-25

Attorney, Agent or Firm:

KASHIMA, YOSHIO (JP)
KAJIMA Yoshio (JP)

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