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Title:
SUBSTRATE BREAKING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/087424
Kind Code:
A1
Abstract:
Provided is a substrate breaking apparatus which can accurately perform breaking position alignment even in the case where a brittle material substrate to be broken is thin and is to be broken with a small pitch. The substrate breaking apparatus is provided with: a substrate supporting plate (2) having an opening section (7) formed thereon in a rectangular shape that corresponds to the shape of a brittle material substrate (1); an elastic film (4) which is formed on the upper surface of the substrate supporting plate (2) and covers the opening section (7); upper breaking bars (6a, 6b) which are arranged to move in the vertical direction above the elastic film (4) and break the substrate along a scribe line (11); and a lower breaking bar (5) which is arranged to move in the vertical direction below the elastic film (4) and breaks the substrate along the scribe line (11). The lower breaking bar (5) is brought into contact with the side opposite to the side having the scribe line (11) formed thereon with pressure along the scribe line (11), and in the state where the brittle material substrate (1) is sandwiched between the lower breaking bar (5) and the first upper breaking bar (6a), the substrate is broken by means of the upper breaking bar (6b).

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Inventors:
SOYAMA, Masanobu (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
Application Number:
JP2010/051185
Publication Date:
August 05, 2010
Filing Date:
January 29, 2010
Export Citation:
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Assignee:
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (2-12-12, Minami-Kaneden Suita-cit, Osaka 44, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
International Classes:
B28B11/14; B26F3/00; B28D5/00; C03B33/06; H01L21/301
Attorney, Agent or Firm:
KASHIMA, Yoshio (409 Yuni Higashi-Umeda 7-2, Minami Ogi-machi, Kita-ku, Osaka-cit, Osaka 52, 〒5300052, JP)
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