Title:
SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2012/073909
Kind Code:
A1
Abstract:
The present invention addresses the problems of: providing a substrate cleaner for copper wiring which sufficiently suppresses the elution of metal copper during the cleaning of a semiconductor substrate after the chemical mechanical polishing (CMP) step in a process for manufacturing the semiconductor substrate, and which permits the removal of particles and impurities such as copper (II) hydroxide and copper (II) oxide generated during the chemical mechanical polishing step (CMP); and of providing a method for cleaning a copper wiring semiconductor substrate characterized by the use of this substrate cleaner for copper wiring. The present invention relates to a substrate cleaner for copper wiring comprising an aqueous solution containing [I] an amino acid represented by General Formula (1), and [II] an alkylhydroxylamine; and to a method for cleaning a copper wiring semiconductor substrate characterized by the use of this substrate cleaner for copper wiring. (In the formula, R1 represents a hydrogen atom, a carboxymethyl group, or a carboxyethyl group; and R2 and R3 each independently represent a hydrogen atom, or a C1-4 alkyl group which may have a hydroxyl group. R1 to R3 cannot all be hydrogen atoms.)
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Inventors:
KAWADA Hiromi (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
川田 博美 (〒01 埼玉県川越市大字的場１６３３ Saitama, 〒3501101, JP)
SHIRAHATA Satoshi (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
白旗 里志 (〒01 埼玉県川越市大字的場１６３３ Saitama, 〒3501101, JP)
MIZUTA Hironori (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
川田 博美 (〒01 埼玉県川越市大字的場１６３３ Saitama, 〒3501101, JP)
SHIRAHATA Satoshi (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
白旗 里志 (〒01 埼玉県川越市大字的場１６３３ Saitama, 〒3501101, JP)
MIZUTA Hironori (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
Application Number:
JP2011/077436
Publication Date:
June 07, 2012
Filing Date:
November 28, 2011
Export Citation:
Assignee:
WAKO PURE CHEMICAL INDUSTRIES, LTD. (1-2 Doshomachi 3-chome, Chuo-ku Osaka-sh, Osaka 05, 〒5408605, JP)
和光純薬工業株式会社 (〒05 大阪府大阪市中央区道修町三丁目１番２号 Osaka, 〒5408605, JP)
KAWADA Hiromi (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
川田 博美 (〒01 埼玉県川越市大字的場１６３３ Saitama, 〒3501101, JP)
SHIRAHATA Satoshi (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
白旗 里志 (〒01 埼玉県川越市大字的場１６３３ Saitama, 〒3501101, JP)
和光純薬工業株式会社 (〒05 大阪府大阪市中央区道修町三丁目１番２号 Osaka, 〒5408605, JP)
KAWADA Hiromi (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
川田 博美 (〒01 埼玉県川越市大字的場１６３３ Saitama, 〒3501101, JP)
SHIRAHATA Satoshi (1633, Oaza Matoba Kawagoe-sh, Saitama 01, 〒3501101, JP)
白旗 里志 (〒01 埼玉県川越市大字的場１６３３ Saitama, 〒3501101, JP)
International Classes:
C11D7/32; C11D7/08; C11D7/10; H01L21/304
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