Title:
SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, PROGRAM AND RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2008/050832
Kind Code:
A1
Abstract:
Provided is a substrate cleaning method for removing particles at a high removing
efficiency from a substrate to be treated, while remarkably suppressing damages
of a wiring pattern. In the substrate cleaning method, the particles (dirt and
the like) attached on the substrate (W) to be treated are removed by immersing
the substrate in a cleaning solution and generating ultrasonic waves in the cleaning
solution. The substrate cleaning method is provided with a step of immersing
the substrate in the cleaning solution in a cleaning tank (12), and a step of generating
the ultrasonic waves in the cleaning solution in the cleaning tank. In the step
of generating the ultrasonic waves, a gas easily dissolved in the cleaning solution
and a gas not easily dissolved in the cleaning solution are dissolved in the cleaning
solution in the cleaning tank.
Inventors:
WATANABE, Tsukasa (650 MitsuzawaHosaka-cho, Nirasaki-sh, Yamanashi 92, 4070192, JP)
渡辺 司 (〒92 山梨県韮崎市穂坂町三ツ沢６５０番地 東京エレクトロン九州株式会社内 Yamanashi, 4070192, JP)
渡辺 司 (〒92 山梨県韮崎市穂坂町三ツ沢６５０番地 東京エレクトロン九州株式会社内 Yamanashi, 4070192, JP)
Application Number:
JP2007/070811
Publication Date:
May 02, 2008
Filing Date:
October 25, 2007
Export Citation:
Assignee:
TOKYO ELECTRON LIMITED (3-6 Akasaka 5-chome, Minato-ku, Tokyo 81, 1078481, JP)
東京エレクトロン株式会社 (〒81 東京都港区赤坂五丁目３番６号 Tokyo, 1078481, JP)
WATANABE, Tsukasa (650 MitsuzawaHosaka-cho, Nirasaki-sh, Yamanashi 92, 4070192, JP)
東京エレクトロン株式会社 (〒81 東京都港区赤坂五丁目３番６号 Tokyo, 1078481, JP)
WATANABE, Tsukasa (650 MitsuzawaHosaka-cho, Nirasaki-sh, Yamanashi 92, 4070192, JP)
International Classes:
H01L21/304; B08B3/12; G11B7/26; H01L21/02; B08B3/12; G11B7/26
Attorney, Agent or Firm:
YOSHITAKE, Kenji et al. (Kyowa Patent & Law Office, Room 323 Fuji Bldg.,2-3, Marunouchi 3-chome,Chiyoda-ku, Tokyo 05, 1000005, JP)