Title:
SUBSTRATE CLEANING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/070993
Kind Code:
A1
Abstract:
The substrate cleaning apparatus is equipped with a cleaning plate (1), a vibrating part (2) which vibrates the cleaning plate (1), suction parts (3, 4) which have suction ports near the front end (1a) of the cleaning plate (1) and which apply suction to the top surface of the substrate (5) without coming into contact with the substrate (5), which is the object to be cleaned, and a moving mechanism (8) which moves the cleaning plate (1) relative to the substrate (5). In the substrate cleaning apparatus, the cleaning plate (1) is elastically deformed by the front end (1a) of the cleaning plate (1) being pressed against the top surface of the substrate (5), and the cleaning plate (1) is moved relative to the substrate (5) in the cleaning direction while the front end (1a) of the cleaning plate (1) is in linear contact or plane contact with the top surface of the substrate (5). By using this configuration, the substrate (5) can be cleaned reliably while preventing scratches from occurring in the substrate (5).
Inventors:
MAKITA, Hideshi (())
牧田 英司 (())
牧田 英司 (())
Application Number:
JP2009/069030
Publication Date:
June 24, 2010
Filing Date:
November 09, 2009
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
MAKITA, Hideshi (())
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
MAKITA, Hideshi (())
International Classes:
B08B1/00; B08B5/04; C03C23/00; G02F1/13; G02F1/1333
Attorney, Agent or Firm:
FUKAMI, Hisao et al. (Fukami Patent Office, Nakanoshima Central Tower 22nd Floor, 2-7, Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)