Title:
SUBSTRATE CLEANING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/176306
Kind Code:
A1
Abstract:
A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (107,207), and an ultra or mega sonic device (206,306). The chuck assembly is configured to receive and clamp a substrate. The at least one first nozzle (107,207) is configured to spray liquid onto the top surface of the substrate. The ultra or mega sonic device (206,306) is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate. A gap is formed between the ultra or mega sonic device (206,306) and the top surface of the substrate, and the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device (206,306) is filled with the liquid all the time during the cleaning process.
Inventors:
WANG HUI (CN)
WU JUN (CN)
CHENG CHENG (CN)
WANG XI (CN)
CHU ZHENMING (CN)
WU JUN (CN)
CHENG CHENG (CN)
WANG XI (CN)
CHU ZHENMING (CN)
Application Number:
PCT/CN2017/078732
Publication Date:
October 04, 2018
Filing Date:
March 30, 2017
Export Citation:
Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
B08B1/04; B08B3/02; B08B7/04; H01L21/304
Foreign References:
| JP2001104893A | 2001-04-17 | |||
| CN103311156A | 2013-09-18 | |||
| CN106024581A | 2016-10-12 | |||
| CN1923381A | 2007-03-07 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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