Title:
SUBSTRATE CLEANING DEVICE, SUBSTRATE CLEANING METHOD, SUBSTRATE PROCESSING DEVICE, AND SUBSTRATE DRYING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/154673
Kind Code:
A1
Abstract:
Provided are a substrate cleaning device, a substrate cleaning method, a substrate processing device, and a substrate drying device that exhibit superior performance. The substrate cleaning device comprises: a substrate-holding rotary mechanism that holds and rotates the substrate; a first cleaning mechanism that brings a cleaning tool into contact with the substrate and cleans the substrate, or that uses a two-stream fluid jet to clean the substrate, or that uses ozone water to clean the substrate; and a second cleaning mechanism that uses an ultrasonic cleaning solution to clean the substrate.
Inventors:
ISHIBASHI TOMOATSU (JP)
Application Number:
PCT/JP2017/007836
Publication Date:
September 14, 2017
Filing Date:
February 28, 2017
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304
Foreign References:
| JP2013206983A | 2013-10-07 | |||
| JP2015099852A | 2015-05-28 | |||
| JP2012209513A | 2012-10-25 | |||
| JPH08148459A | 1996-06-07 | |||
| JPH10163159A | 1998-06-19 | |||
| JP2002009035A | 2002-01-11 | |||
| JPH1064868A | 1998-03-06 |
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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