Title:
SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/080013
Kind Code:
A1
Abstract:
The present invention relates to a substrate cleaning device and a substrate cleaning method for cleaning a substrate, such as a semiconductor wafer, and particularly relates to a substrate cleaning device and a substrate cleaning method for cleaning the periphery of a substrate. The substrate cleaning device (1) is provided with: a substrate holding portion (10) for holding and rotating a substrate (W); a pressing portion (22) having an inner space (R) and which presses a cleaning tape (19) against the periphery of the substrate (W); a pressing portion moving mechanism (30) for controlling the position of the pressing portion (22) in a radial direction of the substrate (W); and a pressure regulator (44) for controlling the pressure of the inner space (R). The pressing portion (22) includes a hollow support member (24) having an opening portion (25), and an elastic body (27) supporting the cleaning tape (19). The elastic body (27) is disposed to close the opening portion (25).
Inventors:
KODERA KENJI (JP)
NAKANISHI MASAYUKI (JP)
NAKANISHI MASAYUKI (JP)
Application Number:
PCT/JP2021/031127
Publication Date:
April 21, 2022
Filing Date:
August 25, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304
Foreign References:
| JP2003234314A | 2003-08-22 | |||
| JPS6434657A | 1989-02-06 | |||
| JP2017094480A | 2017-06-01 | |||
| JP2019216207A | 2019-12-19 | |||
| JP2019119029A | 2019-07-22 | |||
| JP2019091746A | 2019-06-13 | |||
| JP2014144525A | 2014-08-14 | |||
| JPH08192360A | 1996-07-30 | |||
| JP2008518792A | 2008-06-05 | |||
| JP2007181886A | 2007-07-19 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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