Title:
SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2018/128088
Kind Code:
A1
Abstract:
A substrate cleaning method according to an embodiment comprises a film-forming-liquid supply step, a releasing-liquid supply step, and a dissolving-liquid supply step. In the film-forming-liquid supply step, a film-forming liquid, which includes a volatile component and serves to form a film on a substrate, is supplied to the substrate. In the releasing-liquid supply step, pure water as a releasing liquid for releasing the film from the substrate is supplied to the film formed by solidifying or curing the film-forming liquid on the substrate by volatilizing the volatile component. In the dissolving-liquid supply step, after the releasing-liquid supply step, a dissolving liquid for dissolving the film is supplied to the film. Further, in the releasing-liquid supply step, pure water as a releasing liquid is supplied to the film after supplying a mixed liquid of pure water and a liquid having a lower surface tension than pure water to the film.
Inventors:
AIBARA MEITOKU (JP)
KAWANO HISASHI (JP)
ITO NORIHIRO (JP)
OGATA NOBUHIRO (JP)
KAWANO HISASHI (JP)
ITO NORIHIRO (JP)
OGATA NOBUHIRO (JP)
Application Number:
PCT/JP2017/046021
Publication Date:
July 12, 2018
Filing Date:
December 21, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2016034006A | 2016-03-10 | |||
| JP2016036012A | 2016-03-17 | |||
| JPH09107023A | 1997-04-22 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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