Title:
SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2020/004047
Kind Code:
A1
Abstract:
Provided according to an embodiment is a substrate cleaning method including a film-forming-liquid supplying step, a releasing-liquid supplying step, and a hydrophobic-liquid supplying step. In the film-forming-liquid supply step, a film-forming liquid (L1) including a volatile component and serving to form a film on a substrate (W) is supplied to the substrate (W). In the releasing-liquid supply step, a treating film (F) formed by solidifying or curing the film-forming liquid (L1) on the substrate (W) by volatilizing the volatile component is supplied with a releasing liquid (L2) for releasing the treating film (F) from the substrate (W). In the hydrophobic-liquid supply step, the substrate (W) to which the releasing liquid (L2) has been supplied is supplied with a hydrophobic liquid for hydrophobizing the substrate (W).
Inventors:
AIBARA MEITOKU (JP)
Application Number:
PCT/JP2019/023391
Publication Date:
January 02, 2020
Filing Date:
June 13, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2015119164A | 2015-06-25 | |||
| JP2016201385A | 2016-12-01 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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