SUBSTRATE COMPRISING REINFORCING LAYER, PREPARATION METHOD, FOLDABLE COVER PLATE, AND ELECTRONIC DEVICE - GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD

Title:

SUBSTRATE COMPRISING REINFORCING LAYER, PREPARATION METHOD, FOLDABLE COVER PLATE, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/212989

Kind Code:

A1

Abstract:

The present application provides a substrate, comprising: a base layer; and a reinforcing layer, formed on at least one surface of the base layer and made of a mixed material containing a high molecular polymer and a silane coupling agent. The present application further provides a processing method of the substrate containing the reinforcing layer, and a foldable cover plate and an electronic device.

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Inventors:

LIAO YI-HSIANG (CN)

Application Number:

PCT/CN2021/077253

Publication Date:

October 28, 2021

Filing Date:

February 22, 2021

Export Citation:

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Assignee:

GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)

International Classes:

B32B27/32; B32B17/06; B32B17/10; B32B27/06; B32B27/40; B32B33/00; C03C17/00; G09F9/33; H04M1/02; H04M1/18

Foreign References:

CN111497402A	2020-08-07
CN110191606A	2019-08-30
US20110146792A1	2011-06-23
CN108724881A	2018-11-02

Attorney, Agent or Firm:

SCIHEAD IP LAW FIRM (CN)

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