Title:
SUBSTRATE CONNECTING STRUCTURE, AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2017/208598
Kind Code:
A1
Abstract:
This substrate connecting structure is provided with a first substrate, a second substrate, a first connector which is provided on the first substrate, a second connector which is provided on the second substrate and which is connected to the first connector, a pin which is provided on the first substrate and which protrudes from the first substrate and extends along the direction in which the first connector and the second connector are connected, and a guide member which is provided on the second substrate and which has a guide hole into which the pin is fitted. When the pin is fitted in the guide hole, the angle between the pin and the guide hole that occurs in the fitting gap between the pin and the guide hole is set to be less than or equal to a permissible angle for the connection between the first connector and the second connector.
Inventors:
ARAKAWA NAOKI (JP)
Application Number:
PCT/JP2017/012616
Publication Date:
December 07, 2017
Filing Date:
March 28, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04; A61B1/06; G02B23/24
Foreign References:
| JPH02177277A | 1990-07-10 | |||
| JPH0488688U | 1992-07-31 | |||
| JP2016043021A | 2016-04-04 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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