SUBSTRATE CONNECTION STRUCTURE AND SUBSTRATE CONNECTION STRUCTURE MANUFACTURING METHOD

WIPO Patent Application WO/2019/159463

A1

Provided are a substrate connection structure and a substrate connection structure manufacturing method that enable electrically excellent joining between a conductor layer and a metal member and enable prevention of electric corrosion of a joining part. This substrate connection structure comprises: a first covering layer 22 having a first opening 24a; a second covering layer 23 having a second opening 24b aligned with the first opening 24a in the thickness direction; a conductor layer 21 of which the surface on one side is covered with the first covering layer 22 and of which the surface on the other side is covered with the second covering layer 23, the conductor layer 21 having a slit 25 penetrating so as to allow the first opening 24a and the second opening 24b to communicate with each other; a metal member 30 located on the side, of the first covering layer 22, that is opposite to the conductor layer 21; a joining portion 50 formed by joining the metal member 30 and the conductor layer 21 to each other in an electrically conductive manner with an open conductor layer 21a deformed to the metal member 30 side; and a waterproof sealing portion 40 made of waterproof resin and sealing the opening 24 so as to cover the open conductor layer 21a forming the joining portion 50.

KANAYAMA TOMOKI (JP)
SHIROTA KATSUHITO (JP)
KUJIMA TOSHITAKA (JP)

PCT/JP2018/042717

August 22, 2019

November 19, 2018

Click for automatic bibliography generation  

NIPPON MEKTRON KK (JP)

H05K1/14; H05K1/05; H05K1/11; H05K3/28; H05K3/36; H05K3/40

WO2012102091A1

2012-08-02

US6576148B1	2003-06-10
JPH0535589B2	1993-05-26
JPH0213764U	1990-01-29
JPH06314866A	1994-11-08

IAT WORLD PATENT LAW FIRM (JP)

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