Title:
SUBSTRATE CONTAINING APERTURE AND METHODS OF FORMING THE SAME
Document Type and Number:
WIPO Patent Application WO/2013/052215
Kind Code:
A3
Abstract:
A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.
Inventors:
HOOPER ANDY (US)
FINN DARAGH (US)
WEBB TIM (US)
SHEEHAN LYNN (US)
PETTIGREW KENNETH (US)
TAI YU CHONG (US)
FINN DARAGH (US)
WEBB TIM (US)
SHEEHAN LYNN (US)
PETTIGREW KENNETH (US)
TAI YU CHONG (US)
Application Number:
PCT/US2012/052532
Publication Date:
May 30, 2013
Filing Date:
August 27, 2012
Export Citation:
Assignee:
ELECTRO SCIENT IND INC (US)
HOOPER ANDY (US)
FINN DARAGH (US)
WEBB TIM (US)
SHEEHAN LYNN (US)
PETTIGREW KENNETH (US)
TAI YU CHONG (US)
HOOPER ANDY (US)
FINN DARAGH (US)
WEBB TIM (US)
SHEEHAN LYNN (US)
PETTIGREW KENNETH (US)
TAI YU CHONG (US)
International Classes:
H01L21/28; B23K26/38; H01L21/306
Foreign References:
| JPH08250634A | 1996-09-27 | |||
| US20090139570A1 | 2009-06-04 | |||
| KR20100051754A | 2010-05-18 | |||
| US20110131807A1 | 2011-06-09 | |||
| US6864190B2 | 2005-03-08 |
Attorney, Agent or Firm:
EATON, Kurt, M. (Inc13900 NW Science Park Driv, Portland OR, US)
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