Title:
SUBSTRATE CONVEYANCE DEVICE AND HOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/014442
Kind Code:
A1
Abstract:
Disclosed is a substrate conveyance device that can sufficiently hold a substrate to be processed without affecting processing temperature even if warping arises in the substrate to be processed. Further disclosed is a holding device. In an end effector (1), a semiconductor wafer (2') is held by an electrostatic chuck (4), and so it is possible to sufficiently hold the semiconductor wafer (2') without affecting the temperature of the semiconductor wafer (2'). Also, even if warping arises in the semiconductor wafer (2'), the center region (2'c) where warping deformation is low is held by the electrostatic chuck (4), and the region (2'd) surrounding the center region (2'c) is held by holding pins (5). The holding pins (5) are mobile in the direction of protrusion, and are biased towards the direction of protrusion by a spring (18), and so it is possible to sufficiently hold the semiconductor wafer (2') by matching the deformation resulting from warping.
Inventors:
MINAMI, Hirofumi (INC. 2500 Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
南 展史 (〒43 神奈川県茅ヶ崎市萩園２５００番地株式会社アルバック内 Kanagawa, 〒2538543, JP)
南 展史 (〒43 神奈川県茅ヶ崎市萩園２５００番地株式会社アルバック内 Kanagawa, 〒2538543, JP)
Application Number:
JP2011/004192
Publication Date:
February 02, 2012
Filing Date:
July 26, 2011
Export Citation:
Assignee:
ULVAC, INC. (2500 Hagisono, Chigasaki-shi Kanagawa, 43, 〒2538543, JP)
株式会社アルバック (〒43 神奈川県茅ヶ崎市萩園２５００番地 Kanagawa, 〒2538543, JP)
MINAMI, Hirofumi (INC. 2500 Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
株式会社アルバック (〒43 神奈川県茅ヶ崎市萩園２５００番地 Kanagawa, 〒2538543, JP)
MINAMI, Hirofumi (INC. 2500 Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
International Classes:
H01L21/677; B25J15/06; H01L21/683
Attorney, Agent or Firm:
OMORI, Junichi (2nd Floor U&M Akasaka Bldg, 7-5-47 Akasaka Minato-k, Tokyo 52, 〒1070052, JP)
Claims: