SUBSTRATE CONVEYANCE METHOD AND SUBSTRATE CONVEYANCE SYSTEM

WIPO Patent Application WO/2012/014428

A1

Disclosed are a substrate conveyance method and substrate conveyance system that are able to quickly transfer a substrate without losing positional accuracy. Using an electrostatic chuck mechanism in the holding of a substrate (W) by the holding surface (210) of a conveyance robot, the substrate (W) is transferred from a supporting surface (303) to the holding surface (210) in the state wherein an electrostatic attracting force is generated at the holding surface (210). As a result, since it is possible to hold the substrate by means of the electrostatic attracting force starting immediately after the substrate (W) has been transferred to the holding surface (210), it is possible to rapidly execute a substrate (W) conveying operation and thus it is possible to reduce the conveying time of the substrate in a processing space.

MINAMI, Hirofumi (INC. 2500 Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
南　展史 (〒43 神奈川県茅ヶ崎市萩園２５００番地株式会社アルバック内 Kanagawa, 〒2538543, JP)

JP2011/004163

February 02, 2012

July 25, 2011

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ULVAC, INC. (2500 Hagisono, Chigasaki-shi Kanagawa, 43, 〒2538543, JP)
株式会社アルバック (〒43 神奈川県茅ヶ崎市萩園２５００番地 Kanagawa, 〒2538543, JP)
MINAMI, Hirofumi (INC. 2500 Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)

H01L21/677; B25J15/06

OMORI, Junichi (2nd Floor U&M Akasaka Bldg, 7-5-47 Akasaka Minato-k, Tokyo 52, 〒1070052, JP)

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