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Patent Searching and Data


Title:
SUBSTRATE CORRECTION METHOD AND SUBSTRATE CORRECTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/051495
Kind Code:
A1
Abstract:
The present invention excellently performs correction of substrates. A spot for pressing a substrate S is automatically set on the basis of the thickness D of the substrate S and the supporting spots of the substrate S. For example, the spot for pressing the substrate S is set at the center when the thickness D of the substrate S is larger than a first setting value, regardless of where the supporting spots of the substrate S are located (S5), and is set at a spot on the upper surface corresponding to a supporting spot closest to the center of the substrate S when the thickness D of the substrate S is equal to or smaller than a second setting value (S6). Thus, on the basis of the thickness D of the substrate S and the supporting spots of the substrate S, the substrate S can be excellently corrected by appropriately setting the spot for pressing the substrate S.

Inventors:
KATO TAKENOBU (JP)
SHIMIZU TOSHINORI (JP)
KINUTA MINORU (JP)
Application Number:
PCT/JP2016/077494
Publication Date:
March 22, 2018
Filing Date:
September 16, 2016
Export Citation:
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Assignee:
FUJI MACHINE MFG (JP)
International Classes:
B41F15/26; B41F15/08
Foreign References:
JPH0465900A1992-03-02
JP2013071284A2013-04-22
JP2011143549A2011-07-28
JP2005047123A2005-02-24
JP2011020392A2011-02-03
Attorney, Agent or Firm:
CHUBU PATENT OFFICE (JP)
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